Shanghai Maizhu: Leader in key technologies for wafer-level MEMS casting

Publisher:RadiantJourneyLatest update time:2021-12-10 Source: 爱集微Keywords:Wafer Reading articles on mobile phones Scan QR code
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ShanghaiFounded in 2018, MEMS-Casting Semiconductor is an incubated enterprise of Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences. The company is committed to the research and development and industrialization of wafer-level MEMS-Casting technology.

The project that Maizhu Semiconductor is participating in this time is "Wafer-level MEMS Casting Technology", which is a new technology that reduces the macroscopic casting by one million times through micro-nano principles and realizes casting on wafers.

As an underlying platform technology, MEMS-Casting (wafer-level micro-electromechanical casting) is currently mainly used in three fields: through-hole interconnect TSV metallization filling of semiconductor advanced packaging, chip-type spiral coils and radio frequency devices. In the field of semiconductor advanced packaging.

MEMS-Casting, which stands for "casting in the field of micro-electromechanical systems", is an industrial technology that integrates microelectronics technology with mechanical engineering. MEMS-Casting can be used as a substitute for electroplating in thick metal deposition processes. The physical casting method solves the problem of heavy metal pollution caused by electroplating solutions, and it has lower costs and high deposition speed. This technology applies micro-nano principles to casting, thereby reducing casting by one million times. In the field of wafer-level manufacturing, the minimum castable structure size is 20μm, and the maximum can be metallized filling of 8'' wafers. It can also realize the filling of a variety of alloy materials, with the advantages of fast deposition speed, clean and pollution-free process, and very suitable for complex three-dimensional structure manufacturing.

Maizhu Semiconductor introduced that this project is based on the research and development and industrial application of MEMS-Casting technology with completely independent intellectual property rights. MEMS-Casting combines the emerging MEMS technology with traditional casting technology to create a new thick metal deposition method. Compared with electroplating, MEMS-Casting, as a wafer-level thick metal deposition technology, has the advantages of fast deposition speed, clean process without pollution, and is very suitable for manufacturing complex three-dimensional structures. Combined with deep silicon etching technology, MEMS-Casting technology can realize complex three-dimensional manufacturing structures on wafers in batches.

In terms of technology, Maizhu Semiconductor has completed the development of wafer-level MEMS casting equipment, which can meet the process requirements of 4/6/8-inch wafer MEMS casting; completed the process development of zinc-aluminum alloy wafer-level casting; and completed the development and design specifications of special nozzle sheets. The company has also established a research and development center. In addition to the self-developed MEMS casting equipment (currently 4 units), it is also equipped with deep silicon etching equipment, grinding equipment, dicing machines, wire bonding machines and other equipment, forming a relatively complete research and development platform for the technical iteration and scenario application of MEMS-Casting.


Keywords:Wafer Reference address:Shanghai Maizhu: Leader in key technologies for wafer-level MEMS casting

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