ShanghaiFounded in 2018, MEMS-Casting Semiconductor is an incubated enterprise of Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences. The company is committed to the research and development and industrialization of wafer-level MEMS-Casting technology.
The project that Maizhu Semiconductor is participating in this time is "Wafer-level MEMS Casting Technology", which is a new technology that reduces the macroscopic casting by one million times through micro-nano principles and realizes casting on wafers.
As an underlying platform technology, MEMS-Casting (wafer-level micro-electromechanical casting) is currently mainly used in three fields: through-hole interconnect TSV metallization filling of semiconductor advanced packaging, chip-type spiral coils and radio frequency devices. In the field of semiconductor advanced packaging.
MEMS-Casting, which stands for "casting in the field of micro-electromechanical systems", is an industrial technology that integrates microelectronics technology with mechanical engineering. MEMS-Casting can be used as a substitute for electroplating in thick metal deposition processes. The physical casting method solves the problem of heavy metal pollution caused by electroplating solutions, and it has lower costs and high deposition speed. This technology applies micro-nano principles to casting, thereby reducing casting by one million times. In the field of wafer-level manufacturing, the minimum castable structure size is 20μm, and the maximum can be metallized filling of 8'' wafers. It can also realize the filling of a variety of alloy materials, with the advantages of fast deposition speed, clean and pollution-free process, and very suitable for complex three-dimensional structure manufacturing.
Maizhu Semiconductor introduced that this project is based on the research and development and industrial application of MEMS-Casting technology with completely independent intellectual property rights. MEMS-Casting combines the emerging MEMS technology with traditional casting technology to create a new thick metal deposition method. Compared with electroplating, MEMS-Casting, as a wafer-level thick metal deposition technology, has the advantages of fast deposition speed, clean process without pollution, and is very suitable for manufacturing complex three-dimensional structures. Combined with deep silicon etching technology, MEMS-Casting technology can realize complex three-dimensional manufacturing structures on wafers in batches.
In terms of technology, Maizhu Semiconductor has completed the development of wafer-level MEMS casting equipment, which can meet the process requirements of 4/6/8-inch wafer MEMS casting; completed the process development of zinc-aluminum alloy wafer-level casting; and completed the development and design specifications of special nozzle sheets. The company has also established a research and development center. In addition to the self-developed MEMS casting equipment (currently 4 units), it is also equipped with deep silicon etching equipment, grinding equipment, dicing machines, wire bonding machines and other equipment, forming a relatively complete research and development platform for the technical iteration and scenario application of MEMS-Casting.
Previous article:Hopes of alleviating chip shortages are dashed! Chip delivery time in November is extended again
Next article:Jintuo shares: The company's several semiconductor equipment are sold to multiple customers
- Popular Resources
- Popular amplifiers
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thicker
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable development
- Qorvo: Innovative technologies lead the next generation of mobile industry
- BOE exclusively supplies Nubia and Red Magic flagship new products with a new generation of under-screen display technology, leading the industry into the era of true full-screen
- OPPO and Hong Kong Polytechnic University renew cooperation to upgrade innovation research center and expand new boundaries of AI imaging
- Gurman: Vision Pro will upgrade the chip, Apple is also considering launching glasses connected to the iPhone
- OnePlus 13 officially released: the first flagship of the new decade is "Super Pro in every aspect"
- Goodix Technology helps iQOO 13 create a new flagship experience for e-sports performance
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- Analysis of the application of several common contact parts in high-voltage connectors of new energy vehicles
- Wiring harness durability test and contact voltage drop test method
- From probes to power supplies, Tektronix is leading the way in comprehensive innovation in power electronics testing
- From probes to power supplies, Tektronix is leading the way in comprehensive innovation in power electronics testing
- Sn-doped CuO nanostructure-based ethanol gas sensor for real-time drunk driving detection in vehicles
- Design considerations for automotive battery wiring harness
- Do you know all the various motors commonly used in automotive electronics?
- What are the functions of the Internet of Vehicles? What are the uses and benefits of the Internet of Vehicles?
- Power Inverter - A critical safety system for electric vehicles
- Analysis of the information security mechanism of AUTOSAR, the automotive embedded software framework
- MSP430 MCU simulation example: LCD1602 liquid crystal display
- [Atria Development Board AT32F421 Review] Timer PWM Output
- TI Selected Chinese Reference Design Industrial Applications (Full Book)
- EEWORLD University Hall ---- Learn FPGA with you ---- Hao Xushuai team of Sanxin Intelligent
- How to distinguish between field effect transistors and Schottky diodes?
- Introduction to the internal structure of C2000
- Award-winning review: Qinheng RISC-V architecture 32-bit general-purpose MCU CH32V103
- Keep moving forward + review my 2018
- 【IoT Development】Zhengdian Atom STM32 Battleship v3+Gizwits AIoT+APP Control
- Let me express my feelings and talk about phone calls and scammers