Huawei discloses patents related to "chip packaging components"

Huawei Technologies Co., Ltd. recently added a number of new patent information, one of which is named "Chip packaging components, electronic devices and chip packaging component manufacturing methods", with publication number CN113707623A.

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As electronic devices continue to develop in the direction of being thinner, lighter and smaller, the integration of chip packaging components in electronic devices is getting higher and higher. The industry has gradually spawned high-density integrated embedded packaging that buries chips in substrates or packages. However, the above chip packaging components usually have serious heat dissipation problems. The heat generated by the chip cannot be effectively dissipated, which causes certain safety hazards. For this reason, Huawei proposed the above patent.

The patent abstract shows that the purpose of this application is to provide a chip packaging component, an electronic device and a method for manufacturing a chip packaging component, in which the chip in the chip packaging component can be effectively dissipated to effectively reduce safety hazards.

Among them, the chip packaging assembly provided in the present application connects the chip to the upper conductive layer and the lower conductive layer of the packaging substrate, so that the heat generated by the chip can be dissipated by bidirectional conduction, and a heat dissipation part is provided on the upper conductive layer, so that the chip packaging assembly can achieve a better heat dissipation effect.

The electronic device provided in the present application electrically connects the chip packaging component to the mainboard to meet the corresponding circuit transmission function. Moreover, since the electronic device provided in the present application adopts the chip packaging component provided in the present application, the electronic device also has better heat dissipation performance, moisture-proof performance and electromagnetic shielding performance, and its structural stability is strong, which can effectively prevent the chip from being damaged by stress.

In addition, the chip packaging assembly provided in the present application can be manufactured through the manufacturing method of the chip packaging assembly provided in the present application, and the chip packaging assembly has better heat dissipation performance, moisture resistance and electromagnetic shielding performance, and its structural stability is strong, which can effectively prevent the chip from being damaged by stress.