On October 18, at the Quanzhou 2021 Investment Promotion Conference and Project Signing Ceremony, 14 investment projects including the Jinjiang Integrated Circuit Packaging and Testing Industrial Park Project were signed at the main venue, with a contract amount of 71.63 billion yuan.
According to Minnan.com, the Jinjiang Integrated Circuit Packaging and Testing Industrial Park project has a planned total investment of 12 billion yuan and a planned land area of about 300 acres. It will be built with the Quliang Packaging and Testing Project as the leader, give play to the siphon effect of peers, and introduce a number of high- and medium-end packaging and testing projects such as Shengke Nano and Shulian Semiconductor, covering products in the fields of memory chips, logic chips, MEMS, sensors, IGBT, power amplifier devices PA, optical chips, etc., and is committed to building it into an important national packaging and testing base.
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Application Specific Integrated Circuit Design Topic 3 - Verification and Test
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