Yantai releases list of major key technology projects

Recently, the Yantai Municipal Science and Technology Bureau released the list of projects for Yantai's major scientific and technological innovation projects in 2022, covering new materials, new energy and energy efficiency, electronic information, advanced manufacturing and other fields.

In the field of new materials, the projects include the research and development and application of key materials for large-scale integrated circuit planarization, the research and development and industrialization of difluoromethoxy bridge liquid crystal materials for high-end displays, and the preparation of organic-inorganic hybrid photoresists; in the field of electronic information, the projects include semiconductor pump laser manufacturing technology and other projects.

Research and development and application of key materials for planarization of large-scale integrated circuits

The demanding entity is Wanhua Chemical Group Co., Ltd., and the project budget is RMB 24 million.

Demand introduction: In view of the unfavorable situation that my country is dependent on others for key materials for planarization of large-scale integrated circuits, which seriously affects the survival and development of the semiconductor manufacturing industry, we will carry out research, development and process verification of CMP (chemical mechanical polishing) polishing pads and core raw material expanded microspheres to achieve full industrial chain connection of CMP key materials, break the foreign monopoly, fill the domestic gaps, and solve the "bottleneck" technology, materials and application problems that restrict my country's advanced process chip industry.

Requirements for the application: 1. Cooperation mode: joint development; 2. Have a research and development team that supports the research, production and testing of high-end semiconductor materials and processes; 3. Have an independent research and development center and polyurethane core technology platform to meet the research requirements of semiconductor front-end processes and integrated circuit integrated processing, testing and development requirements, be familiar with chemical mechanical polishing technology, and have complete CMP testing methods and process verification lines.

Research and development and industrialization of difluoromethoxy bridge liquid crystal materials for high-end displays

The demanding unit is Shandong Shenghua New Materials Technology Co., Ltd., and the project budget is 56 million yuan.

Demand introduction: The existing difluoromethoxy bridge liquid crystal materials in China generally have serious defects such as poor stability, uncontrollable fluorine loss, low contrast, and low transmittance, which greatly affects the research and development and production of high-performance difluoromethoxy bridge liquid crystal materials in my country. This project will break the long-term monopoly of foreign countries on high-end difluoromethoxy bridge liquid crystal material technology and products, fill the gap in this field in China, and the main performance of the product exceeds the advanced level of similar foreign products.

Requirements for answering the call: 1. The answerer should be a university or research institute with rich experience in application research of high-end display materials, with a R&D team with strong innovation capabilities, advanced laboratories and R&D equipment and other supporting facilities, and the ability to conduct independent experimental verification and testing during the experimental R&D stage; 2. The main members of the team must have a postgraduate degree or above, and technical guidance must be provided by high-level experts with new materials as their research direction.

Preparation of organic-inorganic hybrid photoresist

The demanding unit is Yantai Magic Nanotechnology Co., Ltd., and the project budget is 10 million yuan.

Demand introduction: Photoresist is one of the most critical and technically difficult basic materials in the field of microelectronics technology. The performance requirements for the photoresist suitable for two-photon processing in this project are adjustable refractive index, high initiation activity, high adhesion and low shrinkage. In order to meet the above requirements at the same time, the better solution is to prepare an organic-inorganic hybrid system photoresist, that is, a photoresist containing inorganic particles such as Si, Ti, and Zr. In order to prepare photoresists with the above performance, it is necessary to design materials from key components such as monomers and prepolymers, initiators, and additives.

Requirements for applying for the bid: 1. The applicant must be a chemical material research and development institution or enterprise that has conducted in-depth research in the field of photosensitive materials, especially multi-photon polymerization photoresists, and possesses excellent research and development capabilities and rich experience in the development of organic-inorganic hybrid photosensitive materials, and is familiar with the product industry research and development direction; 2. The applicant must be able to independently design the structure of compounds or prepolymers according to the company's material requirements, and reasonably design the synthesis route to prepare high-purity raw materials; 3. The applicant must have complete analytical and testing equipment to ensure the quality analysis of raw materials; 4. The applicant must have the ability to develop formulas, and can use synthetic raw materials for the preparation of formulated products and test relevant physical performance indicators.

Semiconductor Pump Laser Manufacturing Technology

The demanding unit is Shandong Dongyi Optoelectronic Instrument Co., Ltd., and the project budget is 20 million yuan.

Requirement introduction: The research and development of semiconductor-pumped nanosecond pulse solid-state lasers for military-grade applications involves the following technical challenges: (1) Optimization design of the laser resonant cavity, taking into account indicators such as beam quality, high energy level, and high efficiency; (2) Air-cooled and efficient heat dissipation design to achieve transient laser thermal energy transmission, such as multi-stage cascade semiconductor heat dissipation design; (3) Development of laser pulse jitter compensation technology to achieve stable pulse width and single pulse energy output; (4) Electronic control hardware circuit design to realize laser pulse power supply design and solve current overshoot and amplitude stability problems.

Requirements for applying for the bid: 1. The applicant must have independent core technology for manufacturing semiconductor-pumped solid-state lasers, be able to provide technical support during the laser development phase, assist the company in improving the laser manufacturing process, focus on solving laser stability and reliability, and reduce laser production costs; 2. Have experience in developing laser power modules.