Recently, ArrayComm Wireless Technology (Xiamen) Co., Ltd. (hereinafter referred to as ArrayComm Wireless) completed a B1 round of financing of over 100 million yuan, led by a fund under CICC Capital, followed by Xiamen Venture Capital and Tsinghua Strait, and old shareholders Xiangfeng Investment and Sichuan Merchants Fund continued to increase their investment.
It is reported that this round of financing will be used by Airui Wireless to create more integrated software and hardware products to help customers enter 5G at the fastest speed. The openness and cloudification of 5G network equipment require a more reasonable division of labor and cooperation and higher efficiency in the industry chain. The more integrated 5G DU and solutions can promote and accelerate the commercialization of open 5G network equipment.
Airui Wireless was founded in 2020 and is a 5G core physical layer technology and system solution provider. The team is committed to empowering the open 5G network equipment industry and has provided 5G (sub-6G and millimeter wave), 4G LTE, NB-IoT, and Cat-M physical layer technologies for macro and small base stations to many large wireless equipment vendors, system integrators, and operators at home and abroad.
Airui Wireless's services include baseband software (physical layer and L2/L3 protocol stack), modules (DU, RU and fronthaul gateway), and 4G/5G base station solutions, all of which have been successfully put into large-scale commercial use. It is reported that Airui Wireless provides customers with plug-and-play vDU (PCIe card) and DU based on multiple mainstream 5G base station chip platforms at home and abroad, with 5G physical layer software and L2/L3 protocol stack software pre-integrated.
According to ArrayComm, Li Wei, partner of Xiangfeng Investment, said that Xiangfeng Investment, as the company's first round investor, continued to over-invest in this round of financing and continued to be optimistic about Airui Wireless's team, products and technology research and development capabilities. The company has a good development momentum, and its products have been deployed at a commercial level in different application scenarios in different countries. With the large-scale deployment of 5G construction, the company will play an important role as a core link in the 5G industry chain.
Previous article:Huawei and others completed the world's first 5G high and low frequency CA verification
Next article:my country's 5G base stations are about to exceed one million! The number of 5G mobile terminal connections exceeds 392 million
Recommended ReadingLatest update time:2024-11-16 20:52
- Popular Resources
- Popular amplifiers
- Introduction to Internet of Things Engineering 2nd Edition (Gongyi Wu)
- Optimization research on low-power power system design based on 5G communication technology
- Research on power supply and distribution technology for 5G communication base stations_Gou Zengjie
- High-speed rail 5G antenna technology and selection application analysis
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thicker
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable development
- Qorvo: Innovative technologies lead the next generation of mobile industry
- BOE exclusively supplies Nubia and Red Magic flagship new products with a new generation of under-screen display technology, leading the industry into the era of true full-screen
- OPPO and Hong Kong Polytechnic University renew cooperation to upgrade innovation research center and expand new boundaries of AI imaging
- Gurman: Vision Pro will upgrade the chip, Apple is also considering launching glasses connected to the iPhone
- OnePlus 13 officially released: the first flagship of the new decade is "Super Pro in every aspect"
- Goodix Technology helps iQOO 13 create a new flagship experience for e-sports performance
- Innolux's intelligent steer-by-wire solution makes cars smarter and safer
- 8051 MCU - Parity Check
- How to efficiently balance the sensitivity of tactile sensing interfaces
- What should I do if the servo motor shakes? What causes the servo motor to shake quickly?
- 【Brushless Motor】Analysis of three-phase BLDC motor and sharing of two popular development boards
- Midea Industrial Technology's subsidiaries Clou Electronics and Hekang New Energy jointly appeared at the Munich Battery Energy Storage Exhibition and Solar Energy Exhibition
- Guoxin Sichen | Application of ferroelectric memory PB85RS2MC in power battery management, with a capacity of 2M
- Analysis of common faults of frequency converter
- In a head-on competition with Qualcomm, what kind of cockpit products has Intel come up with?
- Dalian Rongke's all-vanadium liquid flow battery energy storage equipment industrialization project has entered the sprint stage before production
- Allegro MicroSystems Introduces Advanced Magnetic and Inductive Position Sensing Solutions at Electronica 2024
- Car key in the left hand, liveness detection radar in the right hand, UWB is imperative for cars!
- After a decade of rapid development, domestic CIS has entered the market
- Aegis Dagger Battery + Thor EM-i Super Hybrid, Geely New Energy has thrown out two "king bombs"
- A brief discussion on functional safety - fault, error, and failure
- In the smart car 2.0 cycle, these core industry chains are facing major opportunities!
- The United States and Japan are developing new batteries. CATL faces challenges? How should China's new energy battery industry respond?
- Murata launches high-precision 6-axis inertial sensor for automobiles
- Ford patents pre-charge alarm to help save costs and respond to emergencies
- New real-time microcontroller system from Texas Instruments enables smarter processing in automotive and industrial applications
- Huada EVHC32F460 development board evaluation summary
- Four major predictions for the consumer MEMS market in 2021
- FPGA Implementation of Light Band Centerline Extraction in 3D Scanning Images
- Help, looking for a schematic diagram of asm1142
- RT-Thread system solves the problem that low-priority tasks cannot be suspended with high-priority tasks
- Automatically load Cadence Toolbox functional components
- Let's read together! ——Power supply design book recommendations
- What is the problem with the progress bar when AD is doing PCB routing? (The problem has been solved, welcome to continue discussing)
- EEWORLD University Hall----Live Replay: Introduction to Jacinto?7 Industrial Application Processor
- [Repost] How to quickly distinguish common SMT patch components