On June 3, according to the Beijing Securities Regulatory Bureau, CITIC Securities issued a summary report on the guidance work for the initial public offering and listing on the Growth Enterprise Market of Beijing HuaDa Emergent Technology Co., Ltd. (referred to as "HuaDa Emergent").
It was disclosed that on January 13, 2021, CITIC Securities signed a coaching agreement with BGI-JianTian, accepting BGI-JianTian's entrustment as the coaching institution for its initial public offering and listing.
CITIC Securities has completed the listing guidance work for HuaDa JiuTian in accordance with the requirements of laws and regulations, the provisions of the guidance agreement, and the guidance plan and implementation plan formulated by the guidance working group.
The guidance team of CITIC Securities conducted a comprehensive and prudent assessment of HuaDa JiuTian and believed that HuaDa JiuTian already has the basic conditions for issuance and listing.
The coaching working group will continue to work with King & Wood Mallesons lawyers and Daxin Accountants to assist HuaDa JiuTian in the preparations for the company's initial public offering and listing on the GEM.
As of the date of signing of this report, the shareholders of HuaDa JiuTian are as follows:
The report said that HuaDa JiuTian has been developing rapidly in recent years, with a significant increase in revenue. The funds raised from this IPO project will be used to invest in the upgrade of EDA tools for circuit simulation and digital analysis optimization, the upgrade of EDA tools for analog design and verification, the development of EDA tools for specific chip designs, the development of digital design synthesis and verification EDA tools, and to supplement working capital.
According to information, HuaDa JiuTian was established in 2009 and is committed to providing one-stop EDA and related services to the semiconductor industry. It is currently the largest and most technologically powerful EDA leading company in China.
In terms of EDA, HuaDa Empyrean can provide full-process solutions for analog/digital mixed IC design, digital SoC IC design and optimization solutions, EDA tools for wafer manufacturing, and full-process solutions for flat panel display (FPD) design, with a number of globally original leading technologies. The related services provided around EDA include wafer manufacturing engineering services and design support services, among which wafer manufacturing engineering services include PDK development, model extraction, and yield improvement big data analysis.
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