According to Jiwei.com, the market has recently heard that Foxconn is interested in acquiring the 6-inch wafer fab of memory manufacturer Macronix. Today (20), Foxconn Chairman Liu Yangwei confirmed that his company has contacted Macronix and is interested in cooperating on the 6-inch fab, but could not confirm whether it has made a bid.
Central News Agency reported that Liu Yangwei attended the Global 100 Innovation Organizations Award Ceremony this morning and made the above remarks. In addition, Liu Yangwei pointed out that in addition to the 6-inch plant, Hon Hai is also interested in the 8-inch plant and will actively deploy special process semiconductor technology. In addition to automotive semiconductors, the new third-generation silicon carbide semiconductor technology SiC (silicon carbide) is also a focus of the layout.
Previously, Macronix Chairman Wu Minqiu revealed that the company's 6-inch wafer fab did not contribute much to revenue and had low profits. It is currently on the verge of suspension, and the sale is ongoing. If all goes well, it is expected to be finalized in the second quarter.
Previous article:Nanya Technology: Three factors prompted the company to build a new 12-inch advanced wafer fab
Next article:The new generation iPad Pro can be equipped with up to 16GB of RAM
- Popular Resources
- Popular amplifiers
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thicker
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable development
- Qorvo: Innovative technologies lead the next generation of mobile industry
- BOE exclusively supplies Nubia and Red Magic flagship new products with a new generation of under-screen display technology, leading the industry into the era of true full-screen
- OPPO and Hong Kong Polytechnic University renew cooperation to upgrade innovation research center and expand new boundaries of AI imaging
- Gurman: Vision Pro will upgrade the chip, Apple is also considering launching glasses connected to the iPhone
- OnePlus 13 officially released: the first flagship of the new decade is "Super Pro in every aspect"
- Goodix Technology helps iQOO 13 create a new flagship experience for e-sports performance
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- Analysis of the application of several common contact parts in high-voltage connectors of new energy vehicles
- Wiring harness durability test and contact voltage drop test method
- From probes to power supplies, Tektronix is leading the way in comprehensive innovation in power electronics testing
- From probes to power supplies, Tektronix is leading the way in comprehensive innovation in power electronics testing
- Sn-doped CuO nanostructure-based ethanol gas sensor for real-time drunk driving detection in vehicles
- Design considerations for automotive battery wiring harness
- Do you know all the various motors commonly used in automotive electronics?
- What are the functions of the Internet of Vehicles? What are the uses and benefits of the Internet of Vehicles?
- Power Inverter - A critical safety system for electric vehicles
- Analysis of the information security mechanism of AUTOSAR, the automotive embedded software framework
- EEWORLD University Hall ---- Innovation of general-purpose operational amplifier and comparator chip
- [Perf-V Evaluation] Behavior simulation of breathing light based on Perf-V development board
- Using proteus to learn ARM (LPC2103): familiar with the development environment
- Where is the rotation control point of the FILL filler block in PROTEL?
- When using DSP algorithms on FPGA, can only the provided hard core be used?
- Where is this resistor generally used?
- About C6678 running NonOS_UART0_POLL routine
- Several typical examples of C language functions returning local variables
- ROS course 21 course introduction
- 【FAQ】Microchip Live: Pre-configured Wi-Fi MCUs accelerate time to market and simplify production