Wu Hanming: In the post-Moore era, what direction will my country's chip manufacturing take?

Today (17), SEMICON CHINA 2021 was held in Shanghai. Wu Hanming, academician of the Chinese Academy of Engineering and dean of the School of Micro-Nano Electronics at Zhejiang University, delivered a speech entitled "Some Thoughts on Chip Manufacturing in my country".

Wu Hanming pointed out that my country's integrated circuit industry is destined to be difficult, and currently technological innovation faces two major barriers: one is political barriers, and the other is industrial barriers. The former is due to the restrictions on Chinese semiconductors by the Paris Coordinating Committee and the Wassenaar Agreement; the latter is due to the weak basic research on integrated circuits in my country, the lack of industrial technology reserves, and the intellectual property rights deployed by the world's leading companies in the early stage have created obstacles for latecomers to break through.

Currently, Moore's Law still supports the development of new technologies. Wu Hanming believes that "it can be defined as the post-Moore era starting from 2012 or 2013, that is, after 28nm. The slowing of Moore's Law brings some opportunities for those who catch up."

Wu Hanming also said that the technological trends in the post-Moore era lie in high-performance computing, mobile computing, and autonomous perception and computing.

The three major challenges currently facing my country's chip manufacturing are pattern transfer, new materials and processes, and yield improvement.

In the post-Moore era, how will my country's chip manufacturing develop? Wu Hanming pointed out that chip manufacturing requires advanced processes plus special processes, advanced packaging and system structure. "Special processes support the advancement of the system, and advanced packaging technology has great potential," said Wu Hanming.