This week, Visionox (Hefei) successfully lit up its sixth-generation fully flexible AMOLED production line, Huarui Optoelectronics project entered the countdown to full-line lighting, the 11th-generation glass substrate production base project worth more than 4.8 billion yuan was signed in Shenzhen, and several companies including Xinhuazhang, Feiong Innovation, and Shencong Intelligent completed a new round of financing. SMIC Beijing, jointly funded by SMIC, Big Fund II, and Yizhuang State Investment, was established...
Project News
Visionox (Hefei) successfully lights up the sixth-generation fully flexible AMOLED production line
On December 7, the 6th generation flexible AMOLED production line in Hefei invested and built by Visionox's subsidiary Hefei Visionox was successfully lit up.
The total investment of Visionox (Hefei) G6 fully flexible AMOLED production line reached 44 billion yuan. The construction started on December 27, 2018. The substrate size is 1500mm*1850mm, and the designed production capacity is 30K/month. The production line is positioned as fully flexible and high-end.
Huarui Optoelectronics project enters the countdown to full lighting
According to official news from Huarui Optoelectronics, the Huarui Optoelectronics project has entered the countdown to full-line lighting.
Liu Lei, head of Huarui Optoelectronics Array Factory, said that the first Mo&ITO glass coating of the project was successfully completed in mid-November, marking the completion of the physical coating process and equipment debugging work, laying a solid foundation for the lighting of the first product.
Over 4.8 billion yuan 11th generation glass substrate production base project signed in Shenzhen
According to the People's Daily, on December 8, the 2020 Shenzhen Global Investment Promotion Conference was held. At this conference, 40 major projects including the 11th generation glass substrate production base project were signed and displayed.
Among them, Japan's AGC Corporation (Asahi Glass) plans to jointly invest 4.87 billion yuan with TCL Huaxing to build an 11th-generation glass substrate production base project. The project will build two G11 glass substrate back-end grinding and processing production lines with a maximum capacity of 360,000 pieces per month. After reaching full capacity, the annual maximum production volume is expected to be 4.32 million pieces.
Sichuan Agerui OLED new material project officially put into production
Official news from Meishan Tianfu New District shows that Sichuan Agerui OLED new material project was officially put into production recently.
After the project is fully completed, Agri will become the largest and most technologically advanced OLED material mass production base in China, with an annual production capacity of 30 tons of OLED high-purity materials and 200 tons of other functional materials.
Over 1 billion yuan Shunxincheng (Ronggui) high-end chip industrial park laid the foundation stone
On December 7, the groundbreaking ceremony of Shunxincheng (Ronggui) High-end Chip Industrial Park (hereinafter referred to as "Shunxincheng") was held in Block B of Shunde (Ronggui) Artificial Intelligence and Chip Industrial Park in Foshan, Guangdong.
According to Zhujiang Business Daily, Liao Zhuowen, head of Shunxincheng Park and chairman of Gaojin (Guangdong) Chip Technology Co., Ltd., introduced that the park covers an area of 130 acres with a total investment of 1.03 billion yuan. It will build a high-end manufacturing industrial park for semiconductor integrated circuits integrating R&D, design, production, sales and services. The products cover the entire industrial chain including chip R&D, packaging and testing, memory, mobile phone and notebook computer external devices, Internet of Things products, wearable products, etc.
Entreprise's news
SMIC, Big Fund II and Yizhuang State Investment jointly invested in SMIC Beijing
According to Qichacha, on December 7, SMIC Beijing Integrated Circuit Manufacturing (Beijing) Co., Ltd. (referred to as "SMIC Beijing") was established. The legal representative is Jiang Lei. The business scope includes: manufacturing 12-inch integrated circuit wafers, integrated circuit packaging series, etc.
The shareholders of SMIC Beijing include: Semiconductor Manufacturing International Corporation, Beijing Yizhuang International Investment Development Co., Ltd., and National Integrated Circuit Industry Investment Fund II Co., Ltd.
Yunnan Germanium Industry: Agrees that its subsidiary Xinyao Company will accept Huawei Hubble's additional capital of RMB 30 million in cash
On December 10, Yunnan Germanium Industry Co., Ltd. issued an announcement showing that the ninth meeting of the seventh board of directors of Yunnan Germanium Industry Co., Ltd. reviewed and passed the "Proposal on the Capital Increase and Share Expansion of the Controlling Subsidiary and the Company's Waiver of the Priority Right to Subscribe for Capital Contributions", agreeing that the controlling subsidiary Xinyao Company would accept Haobo Investment's capital increase of RMB 30 million in cash, and the investment amount was equivalent to a registered capital of RMB 30 million. Yunnan Germanium Industry Co., Ltd. waived its priority right to subscribe for capital contributions for the newly increased registered capital.
Huawei wins bid for Huaqiao Sugar Factory site in Baiyun District, Guangzhou
On December 7, the land of Huaqiao Sugar Factory in Baiyun District, Guangzhou was successfully sold at the Guangzhou Public Resources Trading Center, and the winner was Huawei Technologies Co., Ltd. According to Yangcheng Evening News, the land is planned to be a new type of industrial land (M0), and is planned to be built into a research and development center, with a total land area of about 178.94 acres and a planned total construction area of about 166,000 square meters, with a transfer fee of 339 million yuan.
SuperCore successfully developed the first set of HTCVD silicon carbide single crystal growth equipment in China
According to official news from SuperCore, Jiangsu SuperCore Semiconductor Co., Ltd. ("SuperCore") has successfully developed the first set of HTCVD silicon carbide (SiC) single crystal growth equipment in China.
This week, many companies including Xinhuazhang, Xinjie Electronics, Feiong Innovation, Xihua Technology, Shenzhen Cong Intelligent, and Xinshijie Microelectronics completed a new round of financing.
Xinhua Chapter
On December 9, X-Link, a leading EDA (electronic design automation) intelligent software and system company, announced the completion of its Series A financing, led by Gaorong Capital, with participation from 5Y Capital (formerly Morningside Venture Capital) and Shanghai Yuhan. The company's existing shareholders, Yunhui Capital, Hillhouse Capital, ZhenFund, BigData Evergreen and Huazhuo Industrial Investment, continued to invest in this round.
Xinhuazhang's Series A financing scale exceeds 200 million yuan. The funds raised will be mainly used to attract and motivate global and cross-border R&D talents, and support the company's comprehensive layout of EDA 2.0 technology research and product development.
XIANGJIE ELECTRONICS
On December 4, the strategic investment signing ceremony between Shanghai Baolong Automotive Technology Co., Ltd. and Xinjie Electronic Technology Co., Ltd. (hereinafter referred to as "Xinjie Electronic") was held in Pudong, Shanghai.
At present, Xinjie Electronics has completed the C and C+ rounds of strategic financing in excess. The C round of financing was led by Junhai Chuangxin, followed by Morningside Capital and Nanjing Jinyu Maowu; at the same time, Xinjie Electronics and Baolong Technology reached a strategic cooperation, and Baolong Technology participated in Xinjie Electronics' C+ round of strategic investment. Xinjie Electronics has raised tens of millions of US dollars in this round, and the financing funds are mainly used for new technology, new product development and working capital reserves.
Exploration Technology
Tianyancha shows that in September, Tanjing Technology completed a new round of equity financing, with investors including Red Star Macalline, Linxin Investment and Juntong Capital. Tanjing has completed multiple rounds of financing, including A round and A+ round, with investors including Linxin Capital, Chaos Capital, Red Star Macalline, Changjiang Securities, and old shareholders continue to invest.
Fion Innovation
On December 7, Feiong Innovations, a leading company in China's high-speed optical communication chips, announced the completion of a B round of financing worth hundreds of millions of yuan. According to official news from Matrix Partners, this round of financing was exclusively led by Matrix Partners China, followed by several well-known investment institutions and industrial capitals including China Unicom CICC, Shenzhen Capital Group, Bohua Capital, Nanjing Jucheng, Lakeside Capital, HGTECH, Suzhou Guofa, and Yunhui Capital.
Xihua Technology
Tianyancha shows that Xihua Technology has recently completed a Pre-A round of financing of tens of millions of yuan, with investors including Xiamen Hefang, Lihe Venture Capital, etc. Xihua Technology was founded in 2018 and is a chip design company focusing on the fields of intelligent perception and computing control.
Deep Smart
According to official news from AISpeech, Shenzhen Cong Intelligent, a chip design company under AISpeech, recently obtained tens of millions of yuan in Pre-A round of financing. Investors include Jingcheng Capital, Zhidao Capital, Fengwu Capital, etc.
After this round of financing, Shencong Intelligence will continue to increase its investment in the research and development of software and hardware integration and full-link voice interaction solutions. At the same time, it will accelerate the optimization and upgrading of product solutions and further expand the investment in R&D, operations and marketing teams.
Core Vision Microelectronics
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