Recently, a new Xiaomi charger with up to 55W fast charging support has been approved by the 3C agency. It seems that Xiaomi's high-end mobile phones will be equipped with this new charger next year.
The new charger that has passed 3C certification has the MDY-12-EQ model. The charger supports charging rates such as 5V/2A, 9V/3A, 20V/2.5A, and 11V/5A. A whistleblower claims that Xiaomi's upcoming mid-to-high-end mobile phones will be equipped with this 55W fast charger. Even the Redmi mobile phones that will be launched next year will be equipped with this new fast charger.
In February this year, Xiaomi launched the Mi 10 and Mi 10 Pro 5G smartphones. The standard version comes with a 30W charger, while the Pro comes with a 50W charger.
The newly discovered 55W fast charger may debut on the Xiaomi Mi 11 series, which is rumored to be officially launched as early as January 2021. It is expected to become the first domestic mobile phone to use the Snapdragon 875 chip.
Redmi, on the other hand, is expected to launch the Redmi K40 Pro flagship in the first quarter of 2021, which will replace the Redmi K30 Pro with 33W fast charging support.
Previous article：Note9: 76% left after 24 hours of use
Next article：iPhone 12 mini: I love it, but the battery is killing me
- Popular Resources
- Popular amplifiers
INA2126E-250- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claimsAccording to foreign media reports, recently, the British consumer rights organization "Which?" filed an antitrust lawsuit against Apple on behalf of approximately 40 million iCloud users, accusing Apple of violating competition laws and seeking up to $30 million in damages. ...
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thickerOn November 11, sources Jukanlosreve and yeux1122 revealed that both Apple and Samsung's ultra-thin high-density battery projects had failed. The two companies had previously tried to develop ultra-thin high-density batteries in their iPhones. ...
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable developmentAt this year's CIIE, Micron shared the latest progress of the Xi'an packaging and testing plant expansion project, and shared with relevant partners on the theme of "Talking about Empowerment: Co-promoting Coexistence of Business and Sustainable Development"....
- Qorvo: Innovative technologies lead the next generation of mobile industryAt the 12th China Hard Technology Industry Chain Innovation Trend Summit held recently, Qorvo China Senior Sales Director Jiang Xiong shared Qorvo's technological innovation and market development in the new generation of 5G applications. ...
- BOE exclusively supplies Nubia and Red Magic flagship new products with a new generation of under-screen display technology, leading the industry into the era of true full-screenBOE (BOE Oriental) exclusively supplies Nubia and Red Magic flagship new products. The new generation of under-screen display technology leads the industry into the era of true full-screen. On November 5, BOE (BOE Oriental) joined hands with Nubia, ...
- OPPO and Hong Kong Polytechnic University renew cooperation to upgrade innovation research center and expand new boundaries of AI imaging
- Gurman: Vision Pro will upgrade the chip, Apple is also considering launching glasses connected to the iPhone
- OnePlus 13 officially released: the first flagship of the new decade is "Super Pro in every aspect"
- Goodix Technology helps iQOO 13 create a new flagship experience for e-sports performance
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- Microchip Accelerates Real-Time Edge AI Deployment with NVIDIA Holoscan Platform
- Microchip Accelerates Real-Time Edge AI Deployment with NVIDIA Holoscan Platform
- Melexis launches ultra-low power automotive contactless micro-power switch chip
- Melexis launches ultra-low power automotive contactless micro-power switch chip
- Molex leverages SAP solutions to drive smart supply chain collaboration
- Pickering Launches New Future-Proof PXIe Single-Slot Controller for High-Performance Test and Measurement Applications
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- The US asked TSMC to restrict the export of high-end chips, and the Ministry of Commerce responded
- The US asked TSMC to restrict the export of high-end chips, and the Ministry of Commerce responded
- MSO6B What are the new features of the new 6B series mixed signal oscilloscope?
- Internal structure of ESP8266 chip
- Primary side issues of push-pull circuits
- [Free trial of Pingtouge Bluetooth Mesh Gateway Development Kit] + Gateway module and sub-device cloud platform and problem solving supplement
- How many components do you think are needed to make an adjustable power supply?
- Purgatory Legend-PS2 Interface War
- A brief introduction to the third generation semiconductors
- STM32H745I-DISCO
- How to program the C2000 on-chip Flash?
- EEWORLD University ---- Tektronix uses mixed signal oscilloscope to explore the secrets of the bus
京公网安备 11010802033920号