Huawei is out of luck: Sources say TSMC's first wave of 3nm production capacity is basically for Apple-EEWORLD

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For Huawei, after the United States upgraded the ban, the blow to their self-developed Kirin chips was the most direct. It is no wonder that Yu Chengdong said that Kirin 9000 (based on TSMC's 5nm process) will be the last edition of Huawei's high-end chips.

According to the latest news, after the 5nm process is put into large-scale production, TSMC's next-generation major chip process technology will be 3nm. It is currently progressing as planned and is scheduled to start risk trial production in 2021 and large-scale production in the second half of 2022.

It is reported that TSMC has prepared four waves of production capacity for the 3nm process, and most of the first wave of production capacity will be reserved for their major customer Apple.

TSMC is currently advancing the 3nm process as planned for large-scale production in the second half of 2022, with a set production capacity of 55,000 wafers per month. However, people familiar with the matter also revealed that 55,000 wafers is the monthly production capacity at the beginning of production, and it will be gradually increased thereafter, and the monthly production capacity will be increased to 100,000 wafers in 2023.

Prior to this, sources revealed that there were reports that Huawei's order to TSMC was 15 million pieces, but due to production time constraints, the order was not fully completed before production was stopped, and in the end only 8.8 million pieces were delivered.

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