According to data from market research firm Omdia, Intel accounted for 17.45% of the global semiconductor market (excluding wafer manufacturing companies) revenue in the second quarter of 2020, ranking first, while Samsung ranked second with a revenue share of 12.49%.
As we all know, the COVID-19 pandemic has stimulated the demand for the "stay-at-home economy", and major semiconductor companies have also ushered in an unexpected boom in the first half of this year. From the top five revenues of the global semiconductor market (excluding wafer manufacturing companies) in Q2 2020, in addition to Intel and Samsung, SK Hynix, Micron and Nvidia ranked third to fifth, with market revenue shares of 6.18%, 4.71% and 2.66% respectively.
The report stated that due to the memory semiconductor super cycle, Samsung ranked first for two consecutive years in 2017 and 2018, but lost to Intel in 2019. However, the revenue share gap between the two companies narrowed from 5.61% in the fourth quarter of 2019 to 5.23% in the first quarter of 2020, and to 4.96% in the second quarter.
Omdia also pointed out that the gap between Samsung and Intel is expected to narrow further in the third quarter of 2020. On the one hand, AMD, Intel's main competitor in the CPU market, released a TSMC-based 7nm CPU, while Intel is lagging behind in 7nm technology and is considering outsourcing the production of 7nm chips. On the other hand, Samsung is still the undisputed number one player in the memory semiconductor market and is gradually expanding its business into system semiconductors such as mobile application processors and CMOS image sensors.
In addition, Omdia said that due to the release of new game consoles in the second half of the year, the demand for GPUs will increase, and Nvidia's revenue share in the third quarter will exceed 3% for the first time. As for other manufacturers, Omdia predicts that despite the US sanctions on Huawei, HiSilicon's share in the third quarter will reach 2.69%, slightly higher than 2.66% in the second quarter.
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