On August 28, a signing ceremony for major projects in Ningbo Hangzhou Bay New Area was held at Ningbo Administrative Conference Center.
A total of 15 projects were signed with a total investment of 25.53 billion yuan.
The deep ultraviolet series of projects signed this time include deep ultraviolet LED semiconductor device projects, LED epitaxy and packaging projects, and LED application product R&D and production projects. Among them, the semiconductor device project has a total investment of 660 million yuan, and plans to build 10 epitaxy and chip production lines and 15 packaging lines, forming an annual production capacity of 100,000 2-inch deep ultraviolet epitaxy, chips and 180 million lamp beads.
In addition, SAIC Volkswagen and Ningbo Hangzhou Bay New Area have once again started in-depth cooperation. SAIC Volkswagen will arrange more than 10 billion yuan for equipment investment. Relying on intelligent manufacturing and digital transformation and upgrading, it will continuously improve the intelligence level of the Ningbo factory and put into production a number of models with advanced intelligent networking functions, including high-end brands.
Previous article:The epidemic caused order delivery delays, and Tongyu Communication's net profit in the first half of the year fell by 46.81% year-on-year
Next article:It is said that Duntech has increased the price by 5% to 10% in order to rush to supply Huawei TDDI.
- Popular Resources
- Popular amplifiers
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thicker
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable development
- Qorvo: Innovative technologies lead the next generation of mobile industry
- BOE exclusively supplies Nubia and Red Magic flagship new products with a new generation of under-screen display technology, leading the industry into the era of true full-screen
- OPPO and Hong Kong Polytechnic University renew cooperation to upgrade innovation research center and expand new boundaries of AI imaging
- Gurman: Vision Pro will upgrade the chip, Apple is also considering launching glasses connected to the iPhone
- OnePlus 13 officially released: the first flagship of the new decade is "Super Pro in every aspect"
- Goodix Technology helps iQOO 13 create a new flagship experience for e-sports performance
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- Keysight Technologies Helps Samsung Electronics Successfully Validate FiRa® 2.0 Safe Distance Measurement Test Case
- Innovation is not limited to Meizhi, Welling will appear at the 2024 China Home Appliance Technology Conference
- Innovation is not limited to Meizhi, Welling will appear at the 2024 China Home Appliance Technology Conference
- Huawei's Strategic Department Director Gai Gang: The cumulative installed base of open source Euler operating system exceeds 10 million sets
- Download from the Internet--ARM Getting Started Notes
- Learn ARM development(22)
- Learn ARM development(21)
- Learn ARM development(20)
- Learn ARM development(19)
- Learn ARM development(14)
- Dinner is coming! Will you come to the EEWorld Shenzhen dinner on the evening of September 8th?
- Display emulation issues
- Temperature Sensing Guide | Understanding the Design Challenges
- Last day! TI live broadcast with prizes | High-performance, low-power embedded edge AI camera applications
- [GD32E503 Evaluation] mig29_Step2 Measure the physical characteristics of DAC and ADC
- Pressure sensor power supply application solution
- RISC-V Manual (Chinese, a guide to the open source instruction set)
- Award Ceremony: Watch the live broadcast to learn more about the principle, operation, and waterproof structure design of ST's latest MEMS barometer
- [Project source code] Design and implementation of multi-channel DDS signal generator based on FPGA
- MSP430F248TPMR Texas TI ultra-low power microcontroller package LQFP