Huawei MatePad Pro decrypted: US dollar components account for only 2%

Last year, Huawei launched the MatePad Pro, which uses the punch-hole screen technology used on mobile phones on tablets, reducing the borders, increasing the screen-to-body ratio, supporting "multi-screen collaboration" and "parallel vision" functions, and seamlessly connecting mobile phones and tablets to make office work more efficient. We have disassembled the Huawei MatePad Pro, and this time we will take you to see what is special about the internal components of the Huawei MatePad Pro.

Huawei MatePad Pro configuration information

SoC: HiSilicon Kirin 990 processor | 7nm process

Screen: 10.8-inch IPS hole-punch screen, resolution 2560x1600

Storage: 6GB RAM + 128GB ROM

Front: 8MP camera

Rear: 13MP camera

Battery: 7250mAh lithium-ion polymer battery

Features: Hole-punch full screen | Multi-screen collaboration | Kirin 990 flagship chip |

Component analysis:

We disassembled the Wi-Fi version of Huawei MatePad Pro. The estimated cost of the whole machine is US$269.18, the total cost of the main control is US$115, and the main control components account for about 42.7% of the total cost of the whole machine.

The main chip of Huawei MatePad Pro is Kirin 990, which adopts 7nm+ EUV process and has a board area 36% smaller than other solutions in the industry. This is the world's first mobile terminal chip with more than 10 billion transistors, reaching 10.3 billion transistors, an increase of 4.4 billion transistors compared with the previous Kirin 980.

In terms of CPU, Kirin 990 5G uses 2 large cores (developed based on Cortex-A76) + 2 medium cores (developed based on Cortex-A76) + 4 small cores (Cortex-A55). Compared with the industry's mainstream flagship chips, its single-core performance is 10% higher and its multi-core performance is 9% higher.

In terms of GPU, the Kirin 990 5G is equipped with a 16-core Mali-G76 GPU. Compared with the industry's mainstream flagship chips, its graphics processing performance is 6% higher and its energy efficiency is 20% better.

In terms of NPU, Kirin 990 5G adopts Huawei's self-developed Da Vinci architecture NPU, which adopts NPU dual large core + NPU micro core computing architecture. In the application scenario of face recognition, the energy efficiency of NPU micro core can be increased by up to 24 times compared with the large core.

It can be seen from the BOM list of major components of Huawei MatePad Pro that there are no American-made components in the main control IC part, and the majority of components are from HiSilicon. This also highlights Huawei's self-research advantages, preventing core components from being "stuck" due to force majeure factors, and can also keep costs controllable.

Huawei MatePad Pro has a total of 1,411 components, of which 1,148 are provided by Japan, accounting for 81.4% of the total, the highest proportion in terms of component count and 4.6% of the cost, mainly in devices and front camera sensors.

China provides 225 components, accounting for 15.9% of the total and 71% of the cost, the highest cost share. The main areas are main control chips, non-electronic devices, connectors and screens.

The United States provides 28 components, accounting for 2% of the total and 4.6% of the cost, mainly in power RF auxiliary ICs.

South Korea provides 3 components, accounting for 0.2% of the total and 15.7% of the cost, mainly flash memory chips. Other countries and regions provide 7 components, accounting for 0.5% of the total and 4.1% of the cost.

We have compiled the top 5 cost of Huawei MatePad Pro components, which are screen, main chip, flash memory, memory and camera sensor. It is worth noting that the screen of Huawei MatePad Pro is an IPS screen from domestic manufacturer Tianma. We are familiar with Huawei's domestic screen suppliers including BOE and Tianma, and these two manufacturers are often seen on Huawei products.

In addition, the Huawei MatePad Pro's rear 13-megapixel camera also uses a camera sensor from domestic manufacturer OmniVision Technologies, but it still uses SK Hynix and Samsung products for memory flash memory.

Huawei MatePad Pro has only 28 components supplied by the United States, but they only account for 2% of the number and 4.6% of the cost, mainly in the power RF auxiliary IC.

Summarize

Currently, Huawei has a choice of Samsung for top-level AMOLED screens, and domestic BOE and Visionox are also gradually improving their product strength. Micron still supplies RAM and ROM, but other manufacturers include Samsung, Toshiba, and Hynix. In the areas of RF front-end, power management, and wireless transceiver, which were previously strangled by Huawei, Huawei has begun to gradually get rid of the constraints of the US supply chain.

In terms of chips, Huawei has basically completed the layout of high, medium and low-end chips. Originally, HiSilicon was able to be self-sufficient, but the latest US ban cut off TSMC's foundry. Domestic foundries are still unable to reach the advanced 5nm process. Low-end and medium-end chips can use MediaTek products, but flagship chips still need strong foundries. At present, Huawei is rushing to stock up during the grace period, and actively looking for Korean equipment to replace American equipment. The more severe the US crackdown on China's semiconductor industry, the faster the de-Americanization process of Chinese local companies will be.