It is expected to be put into production in August this year, and the first phase of Yongsi Electronics Plant 2 has been capped

On May 27, the topping-out ceremony of the Phase I Plant 2 of Yongsi Electronics was held.

Yongsi Electronics is a semiconductor packaging and testing company. It was established on November 13, 2017 and started a high-end IC packaging and testing project in December of the same year. The project took more than five months to complete the preliminary preparations such as factory decoration, equipment procurement and commissioning, and product sampling. On June 1, 2018, Yongsi Electronics' first batch of packaging and testing projects were successfully launched.

Since its establishment at the end of 2017, Yongsi Electronics has spent more than half a year on renovation of the first phase of Factory 1. Its current annual production capacity has reached 2 billion pieces, with annual sales of RMB 1 billion.

According to official news from Yongsi Electronics, the topping-out of the Phase I Plant 2 marks the project has achieved phased results. It is expected to be officially put into production in August this year, with an annual production capacity of 4 billion pieces and annual sales of RMB 2.5 billion.

In addition, it is worth mentioning that the second phase of Yongsi Electronics' factory covering an area of ​​500 acres will start construction at the end of this year.