Xuzhou semiconductor project progresses: Zhongke Zhixin will be put into production in May and mass production in October

Recently, Xuzhou City held an observation and review meeting for major industrial projects in the first quarter, and revealed the relevant progress of semiconductor projects such as Tianke Heda and Zhongke Zhixin.

The Tianke Heda silicon carbide wafer project was officially put into production at the end of March 2020. The project has a total investment of 1 billion yuan, and new production lines for silicon carbide wafers, surface treatment, and packaging will be built, mainly including silicon carbide single crystal growth furnaces and their supporting cutting, grinding, polishing, and testing equipment, with an annual output of 60,000 silicon carbide wafers.

According to the news released by Jinlonghu, Beijing Tianke Heda Semiconductor Co., Ltd. is a high-tech enterprise specializing in the research and development, production and sales of third-generation semiconductor silicon carbide wafers. It is the only company in the domestic third-generation semiconductor silicon carbide materials industry that is listed on the "New Third Board". It ranks first in China and fourth in the world in the silicon carbide substrate industry.

The production equipment of the Zhongke Zhixin wafer-level packaging chip project is currently being installed and debugged, and it is expected to be officially put into production in early May 2020. The first phase of the project will produce 120,000 12-inch wafer-level packaging chips annually; the second phase will build a clean plant of about 30,000 square meters, with an annual output of 1.2 million 12-inch chips.

It is reported that Jiangsu Zhongke Zhixin Integrated Technology Co., Ltd. was jointly established by the Institute of Microelectronics of the Chinese Academy of Sciences, Huajin Semiconductor Packaging Pioneer Technology R&D Center and a listed company. It is committed to the research and development and industrialization of high-end advanced packaging technology for integrated circuits.

In addition, Xinjing Semiconductor's large silicon wafer project is in trial production and is expected to go into mass production in October 2020. The first phase of the project will invest 6.8 billion yuan to build a 12-inch semiconductor large silicon wafer growth and cutting, grinding and polishing production line. The products include 12-inch heavily doped and lightly doped test wafers, polished wafers, and epitaxial wafers, with a planned production capacity of 3.6 million wafers per year.