Samsung's high-end memory chips made in Xi'an account for 37%, and the second phase of the project will add 130,000 monthly production capacity

Recently, Samsung's flash memory chip project in Xi'an has made an important breakthrough, and the second phase of the second phase of the project with an investment of US$8 billion has officially started. According to Xi'an Daily, high-end memory chips "made in Xi'an" account for 37% of Samsung's similar products and 13% of similar products worldwide.

Xi'an Daily reported that the main product produced by Samsung (China) Semiconductor Co., Ltd. is 3D V-Nand flash memory chips, which are currently exported to Europe, America, Southeast Asia and other places through the Korean headquarters. The production line built by Samsung in Xi'an was also one of the most advanced semiconductor production lines in the world at that time, representing the most cutting-edge technology level in the semiconductor industry.

It is reported that Samsung Electronics invested US$10.8 billion in the first phase to build Samsung Electronics' memory chip project and packaging and testing project; the second phase project has a total investment of US$15 billion, mainly manufacturing flash memory chips.

The first phase of the second phase project will invest about US$7 billion and will be completed and put into production in March next year; the second phase will invest US$8 billion and will be completed in the second half of 2021. After the completion of the second phase project, the new production capacity will be 130,000 pieces per month, the new output value will be 30 billion yuan, thousands of jobs will be provided, and a number of supporting electronic information companies will be settled in Xi'an, making it the world's highest level and largest flash memory chip manufacturing base.

In October this year, the National Development and Reform Commission announced the first batch of national strategic emerging industry clusters, and Xi'an's integrated circuit industry cluster was included. According to a previous report by Xi'an Daily, Xi'an's integrated circuit industry has entered the national "first echelon" and has a complete industrial chain of design, wafer manufacturing, packaging and testing.