Feixiang Technology completes over RMB 100 million in B+ round of financing to increase R&D of 5G RF chip products

According to 36Kr, Shenzhen Feixiang Technology Co., Ltd. completed a B+ round of financing with a scale of more than 100 million yuan. This round of financing was led by CICC Capital and Yuanhe Houwang.

Long Hua, Chairman and CEO of Feixiang Technology, said that through this round of financing, Feixiang has obtained sufficient financial support to establish its 5G RF technology advantages, expand its 4G RF market share, and is expected to obtain the first batch of 5G RF market orders.

Chen Liqiang, vice president of Feixiang Technology, said that this round of financing will also be mainly used to increase the research and development of 5G products and the in-depth layout of the domestic supply chain.

It is understood that Shenzhen Feixiang Technology Co., Ltd. was split from the wireless RF division of the listed company National Technology Co., Ltd. and became independent in May 2015, officially becoming a company focusing on RF chips and solutions. Its products include power amplifier chips, switch chips, filter chips and RF front-end module products for 2G, 3G, 4G, 5G, WiFi and IoT.

Chen Liqiang said, "Compared with 4G, 5G needs to support more frequency bands and perform more complex signal processing. The carrier frequency, communication bandwidth and connection speed have also been significantly improved. The importance of the RF front end in the 5G era is more prominent, and correspondingly, higher requirements are placed on the product architecture, chip materials and processes of core components."

"In addition, Feixiang Technology has been positioned to provide RF front-end chips and modules for mid-to-high-end mobile phone models, which also enables it to cope with the 5G replacement wave."

It is reported that Feixiang Technology's 4G power amplifier chip had been adopted by Xiaomi before, and its 4G RF chip had also become the first recommended product for some platform solutions of Qualcomm and HiSilicon.

In terms of 5G RF chip research and development, in December 2017, Feixiang Technology became a member partner of China Mobile's 5G Joint Innovation Center; in February 2018, it was invited to join China Mobile's "5G Terminal Pioneer Program" as one of the first component manufacturers together with RF industry giants in the United States and Japan; and began to launch 5G RF chip products in succession in 2019.