Earlier, there was news that LG will release a new dual-screen mobile phone at the IFA2019 exhibition, which may be named LG V60 ThinQ. However, before the IFA2019 exhibition was officially held, LG released a new phone called LG Q70. It is reported that LG Q70 is also LG's first mobile device with a "punch screen" design.
In terms of configuration, the LG Q70 uses a 6.4-inch "punch screen". The front camera is located in the upper left corner of the front of the screen and adopts a rear fingerprint recognition solution; it is equipped with a Qualcomm Snapdragon 675 processor and supplemented by 4GB RAM + 64GB body storage solution; it adopts a front 13-megapixel camera + a rear 32-megapixel main camera + a 13-megapixel ultra-wide-angle + a 5-megapixel depth of field triple camera solution; the battery capacity is 4000mAh, the weight is 198g, and it supports IP68 dust and water resistance and Hi-Fi Quad DAC technology.
In terms of price, the LG Q70 is priced at 548,900 won (approximately RMB 3,200). This new phone will be launched in South Korea on September 6.
Previous article:Samsung Galaxy A91 screen parameters: 6.67 inches without holes
Next article:120W fast charging is expected to be commercially available? Vivo NEX 3 may be equipped with it
- Popular Resources
- Popular amplifiers
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thicker
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable development
- Qorvo: Innovative technologies lead the next generation of mobile industry
- BOE exclusively supplies Nubia and Red Magic flagship new products with a new generation of under-screen display technology, leading the industry into the era of true full-screen
- OPPO and Hong Kong Polytechnic University renew cooperation to upgrade innovation research center and expand new boundaries of AI imaging
- Gurman: Vision Pro will upgrade the chip, Apple is also considering launching glasses connected to the iPhone
- OnePlus 13 officially released: the first flagship of the new decade is "Super Pro in every aspect"
- Goodix Technology helps iQOO 13 create a new flagship experience for e-sports performance
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- Analysis of the application of several common contact parts in high-voltage connectors of new energy vehicles
- Wiring harness durability test and contact voltage drop test method
- From probes to power supplies, Tektronix is leading the way in comprehensive innovation in power electronics testing
- From probes to power supplies, Tektronix is leading the way in comprehensive innovation in power electronics testing
- Sn-doped CuO nanostructure-based ethanol gas sensor for real-time drunk driving detection in vehicles
- Design considerations for automotive battery wiring harness
- Do you know all the various motors commonly used in automotive electronics?
- What are the functions of the Internet of Vehicles? What are the uses and benefits of the Internet of Vehicles?
- Power Inverter - A critical safety system for electric vehicles
- Analysis of the information security mechanism of AUTOSAR, the automotive embedded software framework
- Omron E6A2
- ADI Think Tank Secrets New Release丨High Speed Circuit Design Guide is now available for download
- 【LAUNCHXL-CC1350-4】- 1: Install CCS on Ubuntu 20.04
- Review summary: RTT & Renesas high-performance CPK-RA6M4 development board
- Two methods of chip unpacking
- MSP430FR25x2 Capacitive Touch Sensing Mixed-Signal Microcontrollers
- Analog circuit basics: from system level to circuit level
- HyperLynx High-Speed Circuit Design and Simulation (II) Reflection due to unequal transmission line impedance and power supply impedance
- OS_STM32F103 V2.0 version project source code.
- I feel that the STM32H750XB is useless.