VeriSilicon's low-power Bluetooth overall IP solution has passed LE Audio full-function certification

Efficiently enable higher quality audio streaming in a variety of applications at lower power and cost

March 28, 2024, Shanghai, China - VeriSilicon announced today that its low-power Bluetooth overall IP solution has fully supported the LE Audio specification released by the Bluetooth SIG, including certification of the LE Audio protocol stack and LC3 codec . The solution is suitable for mobile phones, Bluetooth headsets including true wireless stereo (TWS) headsets, speakers and other wide-ranging audio application scenarios. Certification details can be obtained by searching the qualified design ID number (206187) of the solution on the official website of the Bluetooth SIG.

LE Audio is a new generation of Bluetooth audio technology standard launched by the Bluetooth SIG based on Bluetooth 5.2 and above specifications, aiming to provide a higher quality audio experience. VeriSilicon's low-power Bluetooth overall IP solution includes RF IP, baseband IP and software protocol stack, and has passed Bluetooth 5.3 certification. The solution is based on low-power Bluetooth technology (BLE), has lower power consumption, and uses isochronous channels transmission technology to achieve smaller audio transmission delay and better signal quality. In addition, the solution also supports LE Audio's innovative Bluetooth features such as Auracast™ broadcast audio and multi-stream audio.

VeriSilicon's low-power Bluetooth overall IP solution integrates VeriSilicon's self-developed LC3 codec, which can achieve real-time, low-power and low-distortion audio processing, and supports multiple calculation precisions such as 16-bit, 32-bit fixed-point processing and 32-bit floating-point processing, as well as all LE Audio audio specification configurations to meet the needs of different application scenarios. The LC3 codec is deeply optimized for VeriSilicon's ZSP digital signal processor (DSP), as well as mainstream processors such as Arm Cortex-M and RISC-V, occupies very little memory and CPU resources, and can be easily ported to other MCUs and DSPs . It can be licensed separately to provide customers with flexible integration options; after integration with VeriSilicon's BLE controller and protocol stack, it can also provide customers with a complete LE Audio hardware and software solution, greatly simplifying the development process of high-performance audio products.

"With years of continuous efforts in the field of Bluetooth technology, we have designed hardware reference designs and application software solutions for different market needs based on our own IP and IoT embedded software platform. The full functional certification of LE Audio will further empower our customers to develop next-generation audio products more efficiently with lower power consumption and cost, and accelerate the time to market." said Wang Zhiwei, senior vice president of VeriSilicon and general manager of the custom chip platform business unit. "In the future, VeriSilicon will vigorously expand new application scenarios for LE Audio and bring more abundant solutions to customers. We also look forward to seeing customers use VeriSilicon's solutions to launch more innovative LE Audio products and jointly promote the development of Bluetooth audio technology and market."