Introduction
Chengdu Insega Semiconductor announced that its industry-leading 53Gbaud DML Driver has begun to provide samples. The chip can be widely used in various single-wavelength 100Gbs products, covering 100Gbs to 800Gbs applications.
With the rapid development of 5G, big data, and artificial intelligence, the demand for bandwidth in data centers is increasing day by day. The internal connection rate of data centers is constantly increasing, requiring optical modules to support higher single-wave rates, lower power consumption, and lower costs.
The current market 100G DR1 and 400G DR4 optical module products are mainly based on EML laser or silicon photonic modulator technology architecture. Insigma 53Gbaud DML Driver (ISG-D5619) is a key technological breakthrough in using DML for higher baud rate applications. When used with DFB lasers, it can achieve direct drive single-wave 100Gbs applications, paving the way for lower power consumption and lower cost 53Gbaud applications.
DML technology has been widely used in 100Gbs and 200Gbs single-mode optical modules. Due to bandwidth limitations, DML has not yet been used in 53Gbaud applications. With the emergence of higher-bandwidth DFB lasers, coupled with the excellent performance of ISG-D5619, it is possible to use DML technology for single-wavelength 100Gbs, and it covers various applications from 100Gbs to 800Gbs. In particular, 400G PSM4 and 800G PSM8 optical modules have higher requirements for low power consumption and low cost, and single-wavelength 100Gbs DML can provide an ideal solution for them.
ISG-D5619 DML Driver is based on ISG's authorized invention patent technology, which can effectively reduce the size of the driver and reduce power consumption. It has been widely used in ISG's 50Gbs and 200Gbs products.
ISG-D5619 has begun to provide samples, reference designs and technical support to customers.
About Insigma Semiconductor:
Founded in 2016, Insega Semiconductor Technology Co., Ltd. focuses on the R&D and production of 25G~800G optical communication Driver, CDR, TIA and OSA products. At present, Insega Semiconductor has developed a series of dozens of 25G/50G/100G/200G/400G/800G high-speed optical communication chips and optical component products, and has accumulated a number of related patent technologies. Insega Semiconductor's chips for 5G mid-haul/backhaul are already in the mass production and delivery stage, and many optical device products have completed R&D and trial production and entered the sample or mass production stage. With the mission of meeting customer needs, Insega Semiconductor will continue to innovate, develop more high-speed IC and OSA products, provide customers with first-class products, technologies and related services, and promote the rapid development of 5G and data center optical transmission markets.
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