(Reuters) - U.S. satellite TV provider Dish Network said on Wednesday it has signed an agreement with Qualcomm Inc to become its latest partner to build a 5G network using an open and cloud-based platform by 2023.
Dish is building its network using a new technology called Open Radio Access Network (RAN), which uses software to run network functions on the cloud, reducing the need for physical equipment.
Dish, which owns a $20 billion portfolio of wireless spectrum, has also partnered with Fujitsu, Nvidia, Altiostar and Mavenir to provide different parts of its network.
Nokia, Ericsson and Huawei have traditionally been the main suppliers of telecom network equipment, but the US ban on Huawei has narrowed the options and forced operators to look for other suppliers.
U.S. technology giants including Qualcomm, Microsoft and Intel hope this will give them a chance to expand their businesses in telecommunications equipment, where they already play a role as suppliers of routers, chips and software.
Previous article:China Telecom announces the world's first large-scale commercial use of 5G SA
Next article:Equipment vendors, operators, and users work together to find a way to break through the 5G application bottleneck
Recommended ReadingLatest update time:2024-11-16 11:27
- Wi-Fi 8 specification is on the way: 2.4/5/6GHz triple-band operation
- Three steps to govern hybrid multicloud environments
- Microchip Accelerates Real-Time Edge AI Deployment with NVIDIA Holoscan Platform
- Keysight Technologies FieldFox handheld analyzer with VDI spread spectrum module to achieve millimeter wave analysis function
- Qualcomm launches its first RISC-V architecture programmable connectivity module QCC74xM, supporting Wi-Fi 6 and other protocols
- Microchip Launches Broadest Portfolio of IGBT 7 Power Devices Designed for Sustainable Development, E-Mobility and Data Center Applications
- Infineon Technologies Launches New High-Performance Microcontroller AURIX™ TC4Dx
- Rambus Announces Industry’s First HBM4 Controller IP to Accelerate Next-Generation AI Workloads
- NXP FRDM platform promotes wireless connectivity
- Innolux's intelligent steer-by-wire solution makes cars smarter and safer
- 8051 MCU - Parity Check
- How to efficiently balance the sensitivity of tactile sensing interfaces
- What should I do if the servo motor shakes? What causes the servo motor to shake quickly?
- 【Brushless Motor】Analysis of three-phase BLDC motor and sharing of two popular development boards
- Midea Industrial Technology's subsidiaries Clou Electronics and Hekang New Energy jointly appeared at the Munich Battery Energy Storage Exhibition and Solar Energy Exhibition
- Guoxin Sichen | Application of ferroelectric memory PB85RS2MC in power battery management, with a capacity of 2M
- Analysis of common faults of frequency converter
- In a head-on competition with Qualcomm, what kind of cockpit products has Intel come up with?
- Dalian Rongke's all-vanadium liquid flow battery energy storage equipment industrialization project has entered the sprint stage before production
- Allegro MicroSystems Introduces Advanced Magnetic and Inductive Position Sensing Solutions at Electronica 2024
- Car key in the left hand, liveness detection radar in the right hand, UWB is imperative for cars!
- After a decade of rapid development, domestic CIS has entered the market
- Aegis Dagger Battery + Thor EM-i Super Hybrid, Geely New Energy has thrown out two "king bombs"
- A brief discussion on functional safety - fault, error, and failure
- In the smart car 2.0 cycle, these core industry chains are facing major opportunities!
- The United States and Japan are developing new batteries. CATL faces challenges? How should China's new energy battery industry respond?
- Murata launches high-precision 6-axis inertial sensor for automobiles
- Ford patents pre-charge alarm to help save costs and respond to emergencies
- New real-time microcontroller system from Texas Instruments enables smarter processing in automotive and industrial applications
- Which is more effective in eliminating the back EMF of inductive loads, TVS or varistor?
- The chip cannot be removed
- A must-read summary of drone principles (IV) Professional terminology for drones
- MicroPython Hands-on (36) - MixPY Hello world
- 【i.MX6ULL】Driver Development 12——Capacitive Touch Driver Practice (Part 1)
- MicroPython now supports STM32F413 controller
- Sofa stickers
- Introduction to the ports of MSP430 microcontroller
- Two highlights of EFM32PG22
- Application of ROOM in AD software