AMD is expected to use a new chip stacking technology: greatly reduced latency and significantly improved performance-EEWORLD

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In today's gaming CPU market, AMD is thriving with its X3D series. The latest 9800X3D is also a hot product, and it requires a premium to purchase on second-hand platforms.

According to media reports, AMD recently submitted a new patent, demonstrating the "multi-chip stacking" technology that may be used in the future, which achieves compact chip stacking and interconnection by partially overlapping the chips.

AMD is expected to use a new chip stacking technology: greatly reduced latency and significantly improved performance

AMD's new approach will reportedly reduce the physical distance between components through overlapping chiplets, minimize interconnect delays, and enable faster communication between different chip parts.

It also improves contact area efficiency, making room for more cores, larger caches, and increased memory bandwidth, resulting in significant performance improvements within the same chip size.

This design will also improve power management, as the separate chiplets allow for better control of each unit through power gating.

AMD is expected to use a new chip stacking technology: greatly reduced latency and significantly improved performance

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