Mechanics in Electronic Packaging

Modeling, simulation and cutting mechanics analysis in precision machining (Lecturer: Professor Cheng Kai)
Mechanical issues in electronic packaging (Lecturer: Professor Liu Sheng)
Surface and interface physical mechanics in nano-micro systems - experiments, cross-scale Simulation and theoretical modeling (Lecturer: Researcher Zhao Yapu)
Basic theories and methods of optimal design of advanced lightweight structures (Lecturer: Professor Zhang Weihong)
From "forming" processing to surface integrity and fatigue-resistant manufacturing (Lecturer: Professor Zhang Dinghua)
Micro Scale plastic mechanics and cross-scale correlation (Lecturer: Professor Li Zhenhuan)

• Chapter 1：Mechanics in Electronic Packaging (1) (20 minutes and 32 seconds)

• Chapter 2：Mechanics in Electronic Packaging (2) (21 minutes and 36 seconds)

• Chapter 3：Mechanics in Electronic Packaging (3) (18 minutes and 26 seconds)

• Chapter 4：Mechanics in Electronic Packaging (4) (18 minutes and 10 seconds)

• Chapter 5：Mechanics in Electronic Packaging (5) (19 minutes and 4 seconds)

• Chapter 6：Mechanics in Electronic Packaging (6) (18 minutes and 3 seconds)

• Chapter 7：Mechanics in Electronic Packaging (7) (18 minutes and 9 seconds)

• Chapter 8：Mechanics in Electronic Packaging (8) (18 minutes and 59 seconds)

• Chapter 9：Mechanics in Electronic Packaging (9) (19 minutes and 16 seconds)

• Chapter 10：Mechanics in Electronic Packaging (10) (20 minutes and 54 seconds)

• Chapter 11：Mechanics in Electronic Packaging (11) (21 minutes and 22 seconds)

• Chapter 12：Mechanics in Electronic Packaging (12) (18 minutes and 35 seconds)

• Chapter 13：Mechanics in Electronic Packaging (13) (18 minutes and 24 seconds)

• Chapter 14：Mechanics in Electronic Packaging (14) (19 minutes and 20 seconds)

• Chapter 15：Mechanics in Electronic Packaging (15) (19 minutes and 5 seconds)

• Chapter 16：Mechanics in Electronic Packaging (16) (18 minutes and 13 seconds)

• Chapter 17：Mechanics in Electronic Packaging (17) (20 minutes and 30 seconds)

• Chapter 18：Mechanics in Electronic Packaging (18) (19 minutes and 3 seconds)

• Chapter 19：Mechanics in Electronic Packaging (19) (19 minutes and 57 seconds)

• Chapter 20：Mechanics in Electronic Packaging (20) (21 minutes and 28 seconds)

• Chapter 21：Mechanics in Electronic Packaging (21) (18 minutes and 20 seconds)

• Chapter 22：Mechanics in Electronic Packaging (22) (23 minutes and 10 seconds)

• Chapter 23：Mechanics in Electronic Packaging (23) (29 minutes and 40 seconds)

• Chapter 24：Material issues in high-reliability lead-free soldering (Part 1) (19 minutes and 59 seconds)

• Chapter 25：Material issues in high-reliability lead-free soldering (Part 2) (19 minutes and 6 seconds)