The first joint venture automotive chip design company between a Chinese vehicle manufacturer was established, creating a win-win situation for the entire industry chain

May 9th news: According to official news from BAIC Capital, BAIC Capital,  Imagination  Group and Cuiwei Holdings signed an agreement to jointly establish Beijing Coreda Technology Co., Ltd.

Specifically, the company is the first automotive chip design company jointly established by a Chinese state-owned vehicle enterprise and an international chip giant. It will focus on the research and development of application processors for autonomous driving and voice interaction chips for smart cockpits, and provide advanced solutions in the field of automotive chips for domestic automakers represented by BAIC Group.

BAIC Capital said that this strategic cooperation is an important measure for BAIC to work with Imagination to create intelligent connected car-grade chips and promote the intelligent development of the global automotive industry. Based on Imagination's basic advantages in neural network acceleration (NNA), the joint venture will focus on "storage-computing-in-one" SoC chips with independent core patents, and further improve the application of the existing chip product matrix in the field of in-vehicle voice interaction.

In addition, the joint venture will continue to promote the development of ADAS and intelligent driving perception chips based on Imagination's performance advantages in GPU and image processing, as well as the current development trend of visual and structured light fusion perception.

At the same time, the joint venture will focus on the research and development of application processors for autonomous driving and voice interaction chips for smart cockpits, leveraging Imagination's IP platform advantages, BAIC Group's vehicle manufacturing ecosystem advantages, and the management team's rich industry experience to open up the entire industry chain layout from IP to chips to complete vehicles.

Finally, BAIC Capital also revealed that the intelligent cockpit chip based on voice interaction technology and the L3-L5 multi-level environmental perception solution are expected to be successfully taped out and mass-produced in 2021 and 2022, respectively.