Passive Component Selection Guide for New Energy Vehicles (Part 1)

Publisher:乘风翻浪Latest update time:2019-08-06 Source: TDK电子 Reading articles on mobile phones Scan QR code
Read articles on your mobile phone anytime, anywhere

Passive components used in automobiles are different from general civilian products. They are required to have high reliability and be able to adapt to harsh environments such as high temperature, vibration, and impact. In particular, problems with passive components in the drive control system are likely to cause major accidents with serious consequences. In order to prevent the occurrence of malfunctions in the control system, there are higher requirements for the selection of passive components in the automotive field.


Even if they are used in automobiles, the requirements for component performance are different in different parts of the automobile. Therefore, according to the different usage environments, more detailed selection of the most suitable products and models will help improve performance and reduce costs.


In the next series of articles, the editor will bring you TDK's carefully written application guides to help engineers solve selection problems.


 Today we start with the application of inverter 


Introducing the best xEV "Inverter" related products from the TDK Group's product lineup.



image.png


 1. Multilayer Ceramic Chip Capacitors


image.png

In order to achieve miniaturization and high capacity of multilayer ceramic chip capacitors, we pursue ultra-fine particle size through advanced material technology. We use our unique process technology to establish high-layer technology without misalignment between dielectric layers and electrode layers and multilayer technology with up to 1,000 layers. The interlayer thickness of one layer reaches submicron level. By pursuing thinning and multilayering, even the smallest chip size can achieve high capacity close to tantalum capacitors and extremely high reliability.


Recommended models/series: CGA series MLCC, CEU series resin electrode capacitors, CKG series metal bracket capacitors



  2. CeraLink  

image.png

CeraLink is a compact capacitor for DC link circuit voltage stabilization, which can be used as an absorption capacitor or DC link capacitor. It uses PLZT ceramic as the substrate and is specially optimized for fast switching converters, converters with very small spaces, and converters that need to withstand high temperature environments, providing engineers with a compact component. Its basic component is a ceramic chip, which is assembled into capacitors with larger capacitance using a lead frame (LP series) or modularly (FA and SP series).


Recommended models/series: SP series, LP series



 3. Film capacitors 

image.png

● Long-term stability

● Maximum operating temperature +110 °C

● Strong resistance to high temperature and humidity

● High ripple current capability


Recommended model/series: B3203x series



4.  IGBT DC support capacitor 

image.png

● DC support for electric vehicle motor drive

● Customized products

● Ultra-low ESL and ESR

● Provides high current in high temperature working environment

● Strong structure and terminal design

● Special design suitable for high-speed IGBT and SiC platforms

● Customized size and terminals


Recommended model/series: B25655 series



 5. Sensor 


Chip NTC Thermistor


Chip NTC (Negative Temperature Coefficient Thermistor) is a thermal semiconductor resistor designed for temperature measurement and temperature compensation. Its product portfolio covers various NTC applications that can be long-term reliable and stable in high temperature and high humidity environments, such as smartphones, tablets, automotive electronics, LED modules and industrial applications. The high-precision series of products with high resistance and B value accuracy provide the market with a more accurate temperature measurement solution.


image.png


Recommended model/series: B57***V5 series

image.png

Recommended model/series: NTCG series



 6. Voltage protection devices 


TDK Electronics' Ceramic Transient Voltage Suppressors (CTVS) set the highest standards in ESD protection for automotive applications

image.png


Recommended models/series: CTVS, B725xx series



 7. EMC countermeasure products.


Chip Beads

image.png


TDK's chip bead product line is rich, with ultra-small products of 0.4mm×0.2mm, Gigaspira structure products with high impedance in the GHz band, and products suitable for high current environments of power lines. These products use TDK's unique ferrite technology and play an efficient noise removal function in a wide frequency range. A variety of products are available, including products for automotive use that meet AEC-Q200.



Recommended models/series: MMZ series, MPZ series, KMZ series, KPZ series



8. Common Mode Filter

image.png

Recommended model/series: ACT series




 9. Transformer  


IGBT power transformer


image.png


● Electric vehicle auxiliary transformer

● Small electronic transformers suitable for various topologies

● Gate drive transformer


Recommended models/series: ATEM series


IGBT/FET Transformers

image.png

The IGBT gate drive power supply for the inverter motor for xEV requires a high-voltage insulation transformer.

This series of products adopts a new self-winding structure, which achieves both complete self-winding and high bonding (low leakage inductance), and is an insulation transformer that can provide stable output.
In terms of reliability, the wire-hanging terminal and the plug-in terminal of the winding are separated to improve vibration resistance and establish high-precision terminal flatness.


Recommended models/series: centralized and distributed VGT series



10. Inductor 


image.png

TDK's inductors are classified into three types: multilayer process, winding process, and thin film process.

The unique multilayer circuit board process technology realizes high inductance, high Q, and further miniaturization. The winding process with low power consumption is achieved by reducing the Rdc value through the highly effective closed magnetic circuit structure using High-μ ferrite particles. The thin film process of small, low-profile and high-performance products is achieved through the combination of precision pattern formation and metal magnetic materials.
The product variety is rich, and the best product that meets the required characteristics can be selected for high-frequency circuits, signal circuits, power circuits, etc. In addition, there are also a wide range of products dedicated to vehicles.


Recommended models/series: CLF series, SPM series, TFM series, MLD series



Reference address:Passive Component Selection Guide for New Energy Vehicles (Part 1)

Previous article:MAHLE launches smart bearings for early warning of engine failures
Next article:RoboSense and ControlWorks reach a cooperation to jointly provide intelligent LiDAR systems

Latest Automotive Electronics Articles
Change More Related Popular Components

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews


Room 1530, 15th Floor, Building B, No.18 Zhongguancun Street, Haidian District, Beijing, Postal Code: 100190 China Telephone: 008610 8235 0740

Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号