LED封装厂瞄准发光二极管背光源液晶电视(LED TV)市场将主打两大产品策略。随着低价直下式LED TV倾巢而出,2013年LED TV市场渗透率可望突破90%,市场已趋于饱和,未来成长力道有限(图1、2)。有鉴于此,LED TV品牌商为力巩市占,产品策略朝M型化发展的态势将更趋显着(图3),其中,高阶产品线将採取侧光式架构搭配窄边框的设计;低阶产品线则将导入低价直下式方案,遂让LED封装业者挟不同方案,大举抢攻侧光式和低价直下式架构的LED TV市场版图。
Figure 1 Changes in LED application market output value from 2012 to 2017 Source: IEK, Industrial Technology Research Institute (03/2013)
Figure 2 LED shipments for backlight and lighting applications from 2012 to 2016 Source: NPD DisplaySearch (03/2013)
Figure 3 TV brand manufacturers' TV product line proportions of various types of backlight technology Source: NPD DisplaySearch (03/2013)
Narrow-frame LED TV LED manufacturers compete to launch new 7020 package
In order to highlight the difference of their edge-lit products, LED TV brands are competing to launch narrow-frame designs, prompting LED manufacturers such as Samsung, LG Innotek, Everlight, and Donbay to compete to launch new-generation 7020 packaging solutions with higher luminous efficiency and thinner profiles (Table 1).
亿光电子课长林俊民表示,新一代7020方案係导入新的高性能导线支架塑料环氧树脂(EMC),不仅尺寸为7毫米×2毫米×0.65毫米,高度明显下降,可实现窄边框设计;且发光效率亦可达每瓦90流明,故更适合LED TV品牌商用于量产超窄边框侧光式LED TV。不少韩国和台湾LED封装厂已加紧展开新一代7020方案部署,预计2013年上半年将陆续会有产品问世。
由于传统7020和7030係採用聚对苯二甲酸亚环已基-二亚甲酯(PCT)或高耐热性聚醯胺树脂9T(PA9T)导线支架塑料製造,因此耐热性不佳,发光效率难提升且容易导致光衰。有鑑于此,LED封装厂遂在导线支架塑料改弦易辙,改用耐热度更具竞争力的EMC塑料开发新一代7020方案。
据了解,相较于新一代7020方案,同样採用EMC开发的7030,儘管同样具备高发光效率特性,然囿于长、宽、高尺寸为7毫米×3毫米×0.8毫米,因此薄型化略逊一筹,较不易实现窄边框侧光式LED TV外观设计。
林俊民指出,LED封装厂除戮力透过导线支架塑料EMC提高新一代7020方案的发光效率及达成薄型化之外,亦藉由成本更具竞争力的EMC降低LED封装元件的成本。以LED元件成本结构分析,由于导线支架占LED元件的BOM比重约15%(图4),在採用EMC塑料开发导线支架后,新一代7020导线支架成本可较採用PCT与PA9T塑料开发的导线支架的传统的7020和7030低15%,换言之,新一代7020将较传统的7020和7030方案,成本可减少15%。
Figure 4 LED packaging component cost analysis Source: Everlight Electronics
Strong attack on low-cost direct-type LED TV packaging factory 2W solution attack
On the other hand, the intensifying price war for low-priced direct-lit LED TVs has forced LED packaging manufacturers to compete to release 2-watt 3030, 3535 and 5050 LED packaging components, further helping LED TV brands to reduce the number of LEDs used in backlight sources, thereby lowering the overall bill of materials (BOM) cost of the backlight source.
Lin Junmin said that under the incentive of low-priced direct-lit solutions, the LED TV market penetration rate reached over 70% in 2012, and is expected to reach 90% in 2013, indicating that the market will be saturated. Therefore, in 2013, all LED TV brands will go all out to try to expand their influence through a lower price strategy.
Lin Junmin further pointed out that in the face of the unstoppable trend of low-priced direct-lit LED TVs, LED packaging manufacturers have been required to launch solutions with luminous efficiency exceeding 100-150 lumens per watt and wattages up to 2 watts to meet the needs of LED TV brands to develop lower-priced products.
据了解,以32吋低价直下式LED TV机种为例,1瓦的LED封装元件的使用颗数可从塬本的侧光式LED TV的八十颗,缩减至叁十五颗;然LED封装製造商为迎合LED TV品牌商开发出更低价格的直下式LED TV,2013年将陆续导入新的高性能导线支架EMC量产2瓦LED封装元件,进一步减少低价直下式LED TV使用的LED颗数达叁十颗以下。
It is reported that in order to help LED TV brands reduce the BOM cost of backlight sources, LED packaging companies also plan to develop 3030, 3535 and 5050 LED packaging components with a luminous efficiency of up to 200 lumens per watt through new high-performance wire bracket plastic EMC in the future.
儘管侧光式LED TV仍为各家电视机品牌商的主力产品线,然看好低价直下式LED TV市场前景,LED TV品牌商亦戮力衝刺直下式LED TV方案,以挹注更可观的营收贡献。根据市调机构NPD DisplaySearch预估,叁星于2013年第一季发布新一代薄型化低价直下式LED TV后,在低价直下式LED TV的市占可望从2012年的54%大幅攀升至70%。
随着LED TV品牌商竞相推出M型化的产品策略,LED封装业者亦将积极因应高低阶LED TV市场,分别提供强调薄型化和低成本的方案,且持续借重採用改良后的支架塑料,提升LED封装方案的性能和价格竞争力,并不断在产品线推陈出新,以戮力扩张势力版图。
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