Electronic packaging is the tube shell used to install the built-in chip of the integrated circuit. It plays the role of placing, fixing and sealing, protecting the built-in chip of the integrated circuit, and enhancing its ability to adapt to the environment. The rivet points on the integrated circuit chip, that is, the contact points, are welded to the pins of the packaging tube shell.
Development of electronic packaging
With the rapid development of electronic technology, the miniaturization of packaging and the high density of assembly, as well as the continuous emergence of various new packaging technologies, the requirements for the quality of electronic assembly are getting higher and higher. Therefore, a new industry of electronic packaging has also emerged, called the electronic packaging testing industry. Invisible solder joints can be inspected. The test results can also be qualitatively analyzed to detect faults early. Nowadays, manual visual inspection, online testing, functional testing, automatic optical inspection, etc. are commonly used in the electronic packaging testing industry. Manual visual inspection is relatively limited because it is a method of inspection with the naked eye, but it is also the simplest.
It can only check whether the device is missing, the model is correct, the bridge is connected, and some of the solder joints are not welded. Automatic optical inspection is a detection method that has emerged in recent years. It is a computer-processed, analyzed and compared to judge defects and faults. The advantages are fast detection speed and short programming time. It can be placed in different positions in the production line, which is convenient for timely detection of faults and defects, so that production and detection can be combined into one. It can shorten the time to find faults and defects and find out the causes of faults and defects in time. Therefore, it is now a commonly used detection method.
Electronic Packaging
The application of electronic packaging systematically introduces the main manufacturing technologies of electronic products. The content includes an overview of electronic manufacturing technology, the basis of integrated circuits, integrated circuit manufacturing technology, component packaging process flow, component packaging form and materials, optoelectronic device manufacturing and packaging, solar photovoltaic technology, printed circuit board technology and electronic assembly technology. The book briefly introduces the basic theoretical basis of electronic manufacturing, focusing on semiconductor manufacturing technology, electronic packaging and assembly technology, optoelectronic technology and device manufacturing and packaging, and systematically introduces related manufacturing processes, related materials and applications.
At present, many electronic packaging materials are made of ceramics, glass and metal. However, a new type of sealing material, epoxy resin material, is now available. It is encapsulated with pure epoxy resin colloid. Compared with other materials, it has better sealing performance, and for some special instruments, it can be directly buried in the soil for use and is not corroded. In this way, it is absolutely isolated from the outside world. Many electronic product manufacturers are worried about opening up the overseas market for their products. If they want to open up the overseas market, they should develop distributors in various places, so they need a set of effective distribution systems. In fact, electronic packaging products are simply protective covers for electronic products, which protect electronic products from the influence of the external environment.
For example, chemical corrosion, atmospheric environment, oxidation, etc. In order to make electronic products more durable and extend their lifespan. Therefore, electronic packaging technology is very important. Temperature, gas dosage, etc. must be carefully considered. Too much or too little is not good. Electronic technology has become a precious resource for mankind. Similarly, in the military field, as the Iraq War fully demonstrated, electronic products have become strategic resources and the source of decision-making, directly affecting the advancement and quality of firepower and mobility.
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