Several common standards for circuit board production

1) IPC-ESD-2020: Joint Standard for the Development of Electrostatic Discharge Control Programs. Includes the necessary design, establishment, implementation, and maintenance of electrostatic discharge control programs. Provides guidance for handling and protection during electrostatic discharge sensitive periods based on the historical experience of certain military and commercial organizations.

2) IPC-SA-61 A: Semi-aqueous Cleaning Handbook for Post-Soldering. Covers all aspects of semi-aqueous cleaning, including chemistry, production residues, equipment, process, process control, and environmental and safety considerations.

3) IPC-AC-62A: Post-Solder Aqueous Cleaning Manual. Describes manufacturing residues, types and properties of aqueous cleaners, the process, equipment and technology of aqueous cleaning, quality control, environmental control and employee safety, and the determination and cost of cleanliness.

4) IPC-DRM -4 0E: Desktop Reference Manual for Through-hole Solder Joint Evaluation. It provides detailed descriptions of components, hole walls, and solder surface coverage in accordance with standard requirements, in addition to computer-generated 3D graphics. It covers solder filling, contact angle, soldering, vertical filling, pad coverage, and numerous solder joints.

Defect situation.

5) IPC-TA-722: Soldering Technology Assessment Handbook. Includes 45 articles on various aspects of soldering technology, including general soldering, soldering materials, manual soldering, batch soldering, wave soldering, reflow soldering, vapor phase soldering and infrared soldering.

6) IPC-7525: Stencil Design Guidelines. Provides guidelines for the design and manufacture of solder paste and surface mount adhesive application stencils. Also discusses stencil design for surface mount technology applications and introduces integration techniques with through-hole or flip-chip components, including overprint, double print, and staged stencil design.

7) IPC/EIA J-STD-004: Specifications for soldering fluxes, including Appendix I. Contains technical indicators and classifications of rosin, resin, etc., organic and inorganic soldering fluxes classified according to the halide content and activation degree in the soldering flux; also includes the use of soldering fluxes, substances containing soldering fluxes, and low-residue soldering fluxes used in no-clean processes.

8) IPC/EIA J-STD-005: Specifications for solder paste, including Appendix I. It lists the characteristics and technical requirements of solder paste, as well as test methods and standards for metal content, as well as viscosity, collapse, solder balls, tackiness, and solder paste wetting performance.

9) IPC/EIA J-STD -0 06A: Specification requirements for electronic grade solder alloys, flux and non-flux solid solders. Provides terminology, specification requirements and test methods for electronic grade solder alloys, rod, strip, powder flux and non-flux solders, electronic solder applications, and special electronic grade solders.

10) IPC-Ca-821: General requirements for thermally conductive adhesives. Includes requirements and test methods for thermally conductive dielectrics that bond components to appropriate locations.

11) IPC-3406: Guidelines for Conductive Surface Coating Adhesives. Provides guidance for the selection of conductive adhesives as an alternative to solder in electronics manufacturing.

12) IPC-AJ-820: Assembly and Soldering Manual. Contains descriptions of inspection techniques for assembly and soldering, including terms and definitions; types of printed circuit boards, components and pins, materials for solder joints, component installation, design specifications and outlines; soldering techniques and packaging; cleaning and lamination; quality assurance and testing.

13) IPC-7530: Batch Soldering Process (Reflow Soldering and Wave Soldering) Temperature Curve Guide. Various test methods, techniques and methods are used in the acquisition of temperature curves to provide guidance for establishing the best graphics.

14) IPC-TR-460A: Printed Circuit Board Wave Soldering Troubleshooting Checklist. A list of recommended corrective actions for failures that may be caused by wave soldering.

15) IPC/EIA/JEDEC J-STD-003A. Solderability test for printed circuit boards.

16) J-STD-0 13: Application of Ball Grid Array (SGA) and other high-density technologies. Establishes the specification requirements and interactions required for printed circuit board packaging processes, and provides information for high-performance and high-pin count integrated circuit packaging interconnects, including design principle information, material selection, board manufacturing and assembly technology, test methods, and reliability expectations based on the end-use environment.

17) IPC-7095: Supplement to the Design and Assembly Process of SGA Devices. It provides various useful operation information for people who are using SGA devices or considering switching to array packaging; it provides guidance for the detection and maintenance of SGA and provides reliable information about the SGA field.

18) IPC-M-I08: Cleaning Guidelines Manual. Includes the latest version of IPC Cleaning Guidelines to assist manufacturing engineers in determining cleaning procedures and troubleshooting for their products.

19) IPC-CH-65-A: Cleaning Guide for Printed Circuit Board Assembly. Provides a reference for current and emerging cleaning methods in the electronics industry, including descriptions and discussions of various cleaning methods, and explains the relationship between various materials, processes, and contaminants in manufacturing and assembly operations.

20) IPC-SC-60A: Post-welding solvent cleaning manual. Provides the use of solvent cleaning technology in automatic welding and manual welding, and discusses the properties of solvents, residues, process control and environmental issues.

21) IPC-9201: Surface Insulation Resistance Handbook. Contains the terminology, theory, test process and test methods of surface insulation resistance (SIR), as well as temperature and humidity (TH) testing, failure modes and troubleshooting.

22) IPC-DRM-53: Introduction to the Desktop Reference Manual for Electronic Assembly. Diagrams and photos used to illustrate through-hole mounting and surface mount assembly techniques.

23) IPC-M-103: Surface Mount Assembly Manual Standard. This section includes all 21 IPC documents related to surface mount.

24) IPC-M-I04: Printed Circuit Board Assembly Manual Standard. Contains the 10 most widely used documents related to printed circuit board assembly.

25) IPC-CC-830B: Performance and Qualification of Electronic Insulating Compounds for Printed Circuit Board Assemblies. Conformal coatings meet an industry standard for quality and qualification.

26) IPC-S-816: Surface Mount Technology Process Guide and Checklist. This troubleshooting guide lists all types of process problems encountered in surface mount assembly and their solutions, including bridging, solder leaks, and misaligned component placement.

27) IPC-CM-770D: Printed Circuit Board Component Installation Guide. Provides effective guidance for the preparation of components in printed circuit board assembly, and reviews relevant standards, influence and issuance status, including assembly technology (including manual and automatic as well as surface mount technology and flip chip assembly technology) and considerations for subsequent soldering, cleaning and lamination processes.

28) IPC-7129: Calculation of failures per million opportunities (DPMO) and printed circuit board assembly manufacturing indicators. A benchmark indicator agreed upon by the industry sectors related to calculating defects and quality; it provides a satisfactory method for calculating the benchmark indicator of failures per million opportunities.

29) IPC-9261: Estimation of printed circuit board assembly yield and failures per million opportunities during assembly. Defines a reliable method for calculating the number of failures per million opportunities during printed circuit board assembly, which is a metric for evaluating each stage of the assembly process.

30) IPC-D-279: Design Guide for Reliable Surface Mount Technology Printed Circuit Board Assemblies. A guide to the reliable manufacturing process for surface mount technology and mixed technology printed circuit boards, including design considerations.

31) IPC-2546: Combined Requirements for Transfer Points in Printed Circuit Board Assembly. Describes material movement systems such as actuators and buffers, manual placement, automated screen printing, automated adhesive dispensing, automated surface mount placement, automated plated through hole placement, forced convection, infrared reflow ovens, and wave soldering.

32) IPC-PE-740A: Troubleshooting in Printed Circuit Board Manufacturing and Assembly. Includes case records and corrective activities for problems that occur during the design, manufacturing, assembly and testing of printed circuit products.

33) IPC-6010: Printed Circuit Board Quality Standards and Performance Specifications Manual Series. Includes the quality standards and performance specifications set by the American Printed Circuit Board Association for all printed circuit boards.

34) IPC-6018A: Inspection and testing of microwave finished printed circuit boards. Includes performance and qualification requirements for high-frequency (microwave) printed circuit boards.

35) IPC-D-317A: Guidelines for the Design of Electronic Packages Using High-Speed ​​Technology. Provides guidance for the design of high-speed circuits, including mechanical and electrical considerations and performance testing.