What is bonding?

What is bonding?

Bonding, also known as chip wire bonding and chip lamination, is also called bonding. Bonding is a wire bonding method in the chip production process. It is generally used to connect the internal circuit of the chip with the package pins with gold wire before packaging. Generally, after bonding (that is, after the circuit is connected to the pin), the chip is packaged with black colloid. At the same time, the advanced external packaging technology COB (Chip On Board) is adopted. The process of this process is to implant the tested epitaxial wafer into a special circuit board, and then use gold wire to connect the epitaxial wafer circuit to the circuit board, and then cover the melted organic material with special protection function on the epitaxial wafer to complete the later packaging of the chip.

Advantages of bonding technology
: 1. Bonding chips are corrosion-resistant, shock-resistant and have stable performance.

The advantage of this packaging method is that the stability of the finished product is much higher than that of the traditional SMT patch method, because the SMT patch technology currently used in large quantities is to weld the pins of the chip on the circuit board. This production process is not suitable for the processing of mobile storage products. There are problems such as cold welding, false welding, and leaking welding in the packaging test. In daily use, the solder joints on the circuit board are exposed to the air for a long time and are affected by natural and human factors such as moisture, static electricity, physical wear, and slight acid corrosion, which makes the product prone to short circuit, open circuit, and even burnout. The bonding chip connects the internal circuit of the chip to the packaging pin of the circuit board through gold wire, and then precisely covers it with organic materials with special protection functions to complete the post-packaging. The chip is completely protected by organic materials and isolated from the outside world. There is no moisture, static electricity, and corrosion. At the same time, the organic material is melted at high temperature, covered on the chip, and then dried by the instrument, and seamlessly connected to the chip, completely eliminating the physical wear of the chip, and the stability is higher.

2. Bonding chips are suitable for large-scale mass production

The bonding technology is currently only mastered by a few large epitaxial wafer factories, and the number of wafers opened is at least not less than 100,000 or even higher. The production process is safe and stable, there is almost no product quality problem, and the product consistency is strong and the service life is long. Therefore, large factories with technical strength will use this advanced but high R&D cost production process to process high-end products.

Application of bonding technology
In fact, bonding technology has been widely used around us, such as mobile phones, PDAs, MP3 players, digital cameras, game consoles and other devices. Many LCD screens use bonding technology. Therefore, the quality, performance and specifications of products purchased from international manufacturers are relatively good. For devices with higher and higher operating frequencies and higher requirements for shielding electromagnetic interference, it will be difficult to avoid some technical risks using traditional packaging methods. Using bonding technology is an effective solution to improve it.