W24256S-70L datasheet, PDF - EEWORLD Datasheet

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W24256S-70L: Description32K X 8 CMOS STATIC RAM; Categorystorage storage; File Size95KB，10 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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W24256S-70L Overview

32K X 8 CMOS STATIC RAM

W24256S-70L Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Winbond Electronics Corporation
Parts packaging code	SOIC
package instruction	0.330 INCH, SOP-28
Contacts	28
Reach Compliance Code	_compli
ECCN code	EAR99
Maximum access time	70 ns
I/O type	COMMON
JESD-30 code	R-PDSO-G28
JESD-609 code	e0
length	18.11 mm
memory density	262144 bi
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	28
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP28,.45
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	2.85 mm
Minimum standby current	2 V
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8.41 mm

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Preliminary W24256

32K

8 CMOS STATIC RAM

GENERAL DESCRIPTION

The W24256 is a normal speed, very low power CMOS static RAM organized as 32768

8 bits that

operates on a single 5-volt power supply. This device is manufactured using Winbond's high

performance CMOS technology.

FEATURES

•

Low power consumption:

•

Access time: 70 nS (max.)

•

Active :300 mW

Standby :250

µW

•

Single 5V power supply

•

Fully static operation

•

All inputs and outputs directly TTL compatible

•

Three-state outputs

Battery back-up operation capability

Data retention voltage: 2V (min.)

Packaged in 28-pin 600 mil DIP, 330 mil SOP

and standard type one TSOP (8 mm

13.4

mm)

PIN CONFIGURATIONS

BLOCK DIAGRAM

CLK GEN.

A12

A14

PRECHARGE CKT.

A14

A12

I/O1

I/O2

I/O3

28-pin

DIP

A13

A11

A10

I/O8

I/O7

I/O6

I/O5

I/O4

A13

I/O1

I/O8

CORE CELL ARRAY

512 ROWS

64 X 8 COLUMNS

DATA

CNTRL.

CLK

GEN.

I/O CKT.

COLUMN DECODER

A11 A10 A1 A0 A8 A9

PIN DESCRIPTION

A11

A13

A14

A12

A10

I/O8

I/O7

I/O6

I/O5

I/O4

I/O3

I/O2

I/O1

SYMBOL

A0−A14

I/O1−I/O8

28-pin

TSOP

DESCRIPTION

Address Inputs

Data Inputs/Outputs

Chip Select Input

Write Enable Input

Output Enable Input

Power Supply

Ground

-1-

Publication Release Date: October 1999

Revision A1

W24256S-70L Related Products

	W24256S-70L	W24256-70	W24256Q-70L	W24256Q-70LL	W24256S-70LL	W24256-70LL	W24256	W24256-70L
Description	32K X 8 CMOS STATIC RAM	32K X 8 CMOS STATIC RAM	32K X 8 CMOS STATIC RAM	32K X 8 CMOS STATIC RAM	32K X 8 CMOS STATIC RAM	32K X 8 CMOS STATIC RAM	32K X 8 CMOS STATIC RAM	32K X 8 CMOS STATIC RAM
Is it Rohs certified?	incompatible	-	incompatible	incompatible	incompatible	incompatible	-	incompatible
Maker	Winbond Electronics Corporation	-	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	-	Winbond Electronics Corporation
Parts packaging code	SOIC	-	TSOP	TSOP	SOIC	DIP	-	DIP
package instruction	0.330 INCH, SOP-28	-	8 X 13.40 MM, TSOP1-28	8 X 13.40 MM, TSOP1-28	0.330 INCH, SOP-28	0.600 INCH, PLASTIC, DIP-28	-	0.600 INCH, PLASTIC, DIP-28
Contacts	28	-	28	28	28	28	-	28
Reach Compliance Code	_compli	-	_compli	_compli	_compli	_compli	-	_compli
ECCN code	EAR99	-	EAR99	EAR99	EAR99	EAR99	-	EAR99
Maximum access time	70 ns	-	70 ns	70 ns	70 ns	70 ns	-	70 ns
I/O type	COMMON	-	COMMON	COMMON	COMMON	COMMON	-	COMMON
JESD-30 code	R-PDSO-G28	-	R-PDSO-G28	R-PDSO-G28	R-PDSO-G28	R-PDIP-T28	-	R-PDIP-T28
JESD-609 code	e0	-	e0	e0	e0	e0	-	e0
length	18.11 mm	-	11.8 mm	11.8 mm	18.11 mm	37.08 mm	-	37.08 mm
memory density	262144 bi	-	262144 bi	262144 bi	262144 bi	262144 bi	-	262144 bi
Memory IC Type	STANDARD SRAM	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	-	STANDARD SRAM
memory width	8	-	8	8	8	8	-	8
Number of functions	1	-	1	1	1	1	-	1
Number of terminals	28	-	28	28	28	28	-	28
word count	32768 words	-	32768 words	32768 words	32768 words	32768 words	-	32768 words
character code	32000	-	32000	32000	32000	32000	-	32000
Operating mode	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-	ASYNCHRONOUS
Maximum operating temperature	70 °C	-	70 °C	70 °C	70 °C	70 °C	-	70 °C
organize	32KX8	-	32KX8	32KX8	32KX8	32KX8	-	32KX8
Output characteristics	3-STATE	-	3-STATE	3-STATE	3-STATE	3-STATE	-	3-STATE
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	SOP	-	TSOP1	TSOP1	SOP	DIP	-	DIP
Encapsulate equivalent code	SOP28,.45	-	TSSOP28,.53,22	TSSOP28,.53,22	SOP28,.45	DIP28,.6	-	DIP28,.6
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
Package form	SMALL OUTLINE	-	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	IN-LINE	-	IN-LINE
Parallel/Serial	PARALLEL	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	-	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	240	240	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED
power supply	5 V	-	5 V	5 V	5 V	5 V	-	5 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
Maximum seat height	2.85 mm	-	1.2 mm	1.2 mm	2.85 mm	5.33 mm	-	5.33 mm
Minimum standby current	2 V	-	2 V	2 V	2 V	2 V	-	2 V
Maximum slew rate	0.06 mA	-	0.06 mA	0.06 mA	0.06 mA	0.06 mA	-	0.06 mA
Maximum supply voltage (Vsup)	5.5 V	-	5.5 V	5.5 V	5.5 V	5.5 V	-	5.5 V
Minimum supply voltage (Vsup)	4.5 V	-	4.5 V	4.5 V	4.5 V	4.5 V	-	4.5 V
Nominal supply voltage (Vsup)	5 V	-	5 V	5 V	5 V	5 V	-	5 V
surface mount	YES	-	YES	YES	YES	NO	-	NO
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS	-	CMOS
Temperature level	COMMERCIAL	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	-	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	-	GULL WING	GULL WING	GULL WING	THROUGH-HOLE	-	THROUGH-HOLE
Terminal pitch	1.27 mm	-	0.55 mm	0.55 mm	1.27 mm	2.54 mm	-	2.54 mm
Terminal location	DUAL	-	DUAL	DUAL	DUAL	DUAL	-	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	-	30	30	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED
width	8.41 mm	-	8 mm	8 mm	8.41 mm	15.24 mm	-	15.24 mm

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