Molex Releases Global Survey Results on Current State of Wearable Diagnostics and Future of Healthcare Monitoring

Publisher:EE小广播Latest update time:2022-09-29 Source: EEWORLDKeywords:Molex Reading articles on mobile phones Scan QR code
Read articles on your mobile phone anytime, anywhere

Molex Releases Global Survey Results on Current State of Wearable Diagnostics and Future of Healthcare Monitoring 


61% of respondents said patients and consumers are the top advocates for wearable diagnostics, while 47% said physicians and medical professionals are driving adoption

Regulatory approval for medical use is the primary barrier to adoption, along with the need for more effective data from existing health trackers

Five design challenges: cost, durability, power, miniaturization, and data acquisition

Energy harvesting holds promise for powering wearables, but requires time and innovation


image.png


Lisle, IL – September 29, 2022 – Molex, a global electronics leader and connectivity innovator, announced the results of a global survey of design engineering practitioners to identify market drivers influencing the development of wearable diagnostic devices. Wearable diagnostic devices enable patients, caregivers and consumers to monitor and analyze health data. Respondents said consumers have high expectations for the use and innovation of wearable devices in sports and fitness, health and medical monitoring applications. The survey results also identify regulatory, technical and adoption barriers that must be cleared to drive improvements in wearable devices for health, fitness and medical monitoring, making them smaller and more powerful. 


“The entire wearable diagnostics space is converging as medical device companies and technology innovators work to bring industry-changing products to market,” said Tyson Masar, global medical director, Molex. “Emerging applications present new requirements, which is why it’s critical for design engineers to understand the needs of all stakeholders and how those requirements impact decisions made throughout the product lifecycle, from early device design concepts to large-scale commercialization.”


Molex and Avnet commissioned Dimensional Research to conduct the Wearable Diagnostics: The Future of Healthcare Monitoring global survey in August 2022, which surveyed 603 qualified individuals responsible for engineering design of wearable diagnostic devices. The survey asked a variety of questions to understand the pace of product adoption and the impact of the growing ecosystem of advocates, while also assessing the challenges and trade-offs that are hindering product delivery.


The publicity and acceptance continue to increase


A growing number of advocates encourage the use of wearable diagnostic devices, led by patients and consumers (61%), physicians and other healthcare professionals (47%), and family caregivers (44%). Not surprisingly, insurance companies, some physicians and other healthcare professionals, and medical technologists remain hesitant or opposed. 


However, design engineers say that within the next five years, consumers can expect to directly adopt devices that support obesity management (61%), posture sensing and correction (59%), respiratory disease detection (51%), reproductive health monitoring (50%), and infectious disease monitoring (49%). New medical wearable devices expected to be launched within five years include diabetes tracking devices, sleep monitoring devices, gait analysis devices, CT mobile devices, and genetic abnormality and vision loss detection devices.


Ongoing design challenges 


Despite their optimism about the future, nearly all respondents cited design challenges, such as consumer expectations for ease of use (42%), the need for simple user interfaces and complete documentation (41%), design difficulties in uncontrolled home care environments (40%), and the complexity of the regulatory approval process (34%). Other areas that hinder the design process include cost (38%), durability (37%), power (35%), miniaturization (33%), data collection (30%), and connectivity (30%). In fact, three-quarters of respondents said that connectivity limitations affect the current ability to collect relevant data to track and analyze health conditions.


According to respondents, there are five major barriers to designing smaller wearable devices, including miniaturization of sensing components (40%) and miniaturization of hardware (such as connectors) (39%), as well as power management (32%), signal quality (29%) and thermal management (22%). The top three material innovations mentioned by respondents include biocompatibility, published functional and reliability data for new materials, and "wear testing" simulations in real-world environments.


Energy harvesting draws attention


Overall, respondents are optimistic about the potential of harvesting patient energy (e.g., body temperature, sweat, heartbeat, motion, etc.) to power wearable devices. While acknowledging that it will take time and innovation to advance this area, respondents identified motion (49%), body temperature (35%), and sweat (13%) as the most viable sources of energy harvesting. 


Collaboration is expected to drive global innovation


63% of respondents said that close collaboration between industry, government and academic groups is expected to drive the greatest innovation in wearable diagnostics. Although nearly three-quarters of respondents from China ranked teamwork as highly important, the responses of respondents in the UK (52%), France (57%) and Germany (59%) were closer to those in the US (61%).  


Keywords:Molex Reference address:Molex Releases Global Survey Results on Current State of Wearable Diagnostics and Future of Healthcare Monitoring

Previous article:Huawei cooperates with 301 Hospital to present new research results on heart health at the European Society of Cardiology (ESC) Annual Meeting
Next article:MIT develops new robotic drug capsule that can penetrate mucus barriers for oral insulin delivery

Recommended ReadingLatest update time:2024-11-15 15:01

Molex New Product Express丨SlimStack Board-to-Board Connector 0.35mm terminal pitch, 0.60mm height, fully armored ACB6 reinforced series
Molex New Product Express丨SlimStack Board-to-Board Connector 0.35mm terminal pitch, 0.60mm height, fully armored ACB6 reinforced series As an authorized distributor of Molex, Heilind can provide relevant product services and support to the market. In addition, it also supplies products from many of the world's top m
[Industrial Control]
Molex New Product Express丨SlimStack Board-to-Board Connector 0.35mm terminal pitch, 0.60mm height, fully armored ACB6 reinforced series
Molex deploys expanded high-speed interconnect solutions
Meeting the needs of next-generation hyperscale and enterprise data centers • Delivery of 400G and 100G optical data center, cloud and wireless applications • New 112G active cables join copper solutions to extend cable reach • Provides a complete product selection, allowing you to "mix and match" products based
[Network Communication]
Molex deploys expanded high-speed interconnect solutions
Molex provides high-speed structured cabling and innovative network infrastructure
“Education and research technology is advancing at an incredible pace. Molex Connected Enterprise Solutions are uniquely positioned to fully prepare for the infrastructure of the future,” said Adrian Newsome, regional sales director, Molex Connected Enterprise Solutions. “With our network of highly skilled certified i
[Internet of Things]
Mouser and Molex jointly hold FPC online seminar to enhance interconnect design
Mouser Electronics, an electronic component distributor focused on introducing new products to drive industry innovation, announced that it will hold a new online seminar with Molex from 10:00 to 11:30 on March 24. The topic of discussion will focus on "Molex flexible and transparent printed circuit solutions and thei
[Semiconductor design/manufacturing]
Mouser and Molex jointly hold FPC online seminar to enhance interconnect design
Molex Names Digi-Key Electronics the 2021 Global Electronics Catalog Distributor of the Year
Digi-Key Electronics, a global distributor of electronic components with a broad assortment and fast shipping, has been recognized by Molex with the 2021 Global Electronics Catalog Distributor of the Year Award at the 2022 EDS Leadership Summit held May 10-13 in Las Vegas. This is the fourth time Digi-Key has won the
[Internet of Things]
Molex Names Digi-Key Electronics the 2021 Global Electronics Catalog Distributor of the Year
Molex releases miniaturization technology report highlighting insights and innovations from experts in product design engineering and cutting-edge connectivity
Molex releases miniaturization technology report highlighting insights and innovations from experts in product design engineering and cutting-edge connectivity ● The miniaturization trend affects every industry from automobiles and consumer products to data centers and medical equipment as more and more function
[Industrial Control]
Molex releases miniaturization technology report highlighting insights and innovations from experts in product design engineering and cutting-edge connectivity
Molex Launches Rugged Brad HarshIO M8 Ethernet Module
Compact 30mm digital HarshIO modules provide IP67-rated on-machine Ethernet connectivity between I/O and control systems using PROFINET fieldbus    (Singapore – September 25, 2013)   Molex, a leading global supplier of a full range of interconnect products, has introduced the new Ethernet version of the Brad® Harsh
[Analog Electronics]
Molex Launches Rugged Brad HarshIO M8 Ethernet Module
Molex Receives Cisco's 2019 Technology Excellence Award
Molex, a leading global manufacturer of electronic solutions, has been announced as a winner of Cisco’s 2019 Technology Enablement Excellence Award. Cisco announced the winners at its 28th annual Supplier Appreciation Event at the Santa Clara Convention Center in California, USA.   This award recognizes Molex for crea
[Semiconductor design/manufacturing]
Latest Medical Electronics Articles
Change More Related Popular Components

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews


Room 1530, 15th Floor, Building B, No.18 Zhongguancun Street, Haidian District, Beijing, Postal Code: 100190 China Telephone: 008610 8235 0740

Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号