Patent data shows TSMC leads in advanced chip packaging wars-EEWORLD

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According to news on August 2, according to patent data from LexisNexis, TSMC is ahead of other competitors in advanced chip packaging technology, followed by South Korea's Samsung Electronics and the United States' Intel. Advanced chip packaging technology is a key technology that can improve chip performance and is crucial for manufacturers competing for chip foundry business.

Data from LexisNexis, a data and analysis company, shows that TSMC has 2,946 advanced chip packaging patents, which are of the highest quality. This indicator includes the number of times the patents are cited by other companies. Samsung Electronics ranks second in terms of patent quantity and quality, with 2,404 patents. Intel ranks third with 1,434 patents.

As it becomes increasingly difficult to integrate more transistors on a single piece of silicon, advanced chip packaging technology is critical to improving semiconductor design. The technology allows the industry to stack or splice multiple chips, called "chiplets," next to each other in the same container.

Samsung Electronics has invested in advanced chip packaging technology for years, but the company established a dedicated team in December 2022 to develop the technology, Moonsoo Kang, the head of the team, said in a statement.

Intel rejected the idea that the size of TSMC's patent portfolio indicates that it has more advanced technology. Benjamin Ostapuk, vice president of the company's intellectual property law group, said in a statement that the company's patents protect its intellectual property and that its patent investments are made through Carefully selected.

TSMC declined to comment.

Keywords：TSMC Reference address：Patent data shows TSMC leads in advanced chip packaging wars

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