More than half are domestic companies! In February, 95 global electronics companies received a total of US$3 billion in investment

Publisher:悠然自在Latest update time:2022-03-09 Source: 编译自semiengineering Reading articles on mobile phones Scan QR code
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Angke Technology raised "tens of millions of yuan" from Shenzhen Hi-Tech Investment. Angke Technology is a semiconductor chip burning company that can provide users with products such as burners, automatic burners, as well as automotive electronic automatic burning solutions, online automatic burning solutions, automatic burner rental services and other services. Founded in 2013, Angke Technology is headquartered in Shenzhen.


科韵激光完成数千万元人民币的A+轮融资。本轮融资由TCL创投领投,并由乾融控股以及苏州韵兴创投联合跟投 。本轮融资资金,公司将会全部投入显示、PCB 和半导体激光设备的研发和制造。科韵激光在显示面板领域将持续深耕,在 PCB 和半导体领域不断进行技术迭代和产品升级,最终实现公司DPS三个业务齐头发展的战略规划。公司主营业务是在面板显示(Display)、PCB 和半导体(Semi)三个行业领域中激光应用设备的研发、制造、销售和维护,成立于2018年,总部位于苏州。


Inspection and testing


Jingji Semiconductor Technology, also known as Jingji Microelectronics, received a strategic investment of RMB 300 million (approximately US$47.5 million) from Spinnotec, Neptune Capital and other companies. The company provides brightfield wafer defect inspection equipment. Founded in 2021, it is headquartered in Shanghai, China.


Zhongan Semiconductor, a developer of semiconductor material testing equipment, announced the completion of a RMB 200 million Series A financing round, led by SMIC Juyuan and Yuanhe Puhua, with participation from Jiangbei Science and Technology Investment, Sequoia Capital, and old shareholders Walden International and Jinmao Capital. The An Semiconductor project team has core silicon wafer testing technology. This project is mainly to develop semiconductor silicon wafer flatness and three-dimensional morphology testing equipment, and is engaged in the development of 200mm and 300mm silicon wafer flatness and three-dimensional morphology testing equipment. In the future, it will fill a gap in the domestic semiconductor industry chain by developing silicon wafer flatness and shape measurement equipment with independent intellectual property rights and Chinese patents. Founded in 2020, it is headquartered in Nanjing.


Machine vision sensor company "Deep Vision Intelligence" recently announced the completion of a B+ round of financing of several hundred million yuan. This round of financing was jointly led by Matrix Partners and Hillhouse Capital, and followed by industrial capital. The financing funds will be mainly used to increase R&D investment, team growth, and enrich product lines. Shenzhen Deep Vision Intelligent Technology Co., Ltd. was established in 2014 and focuses on machine vision, 3D algorithms, optical imaging, hardware acceleration, precision measurement and other fields. The company's main products include the first ultra-high-speed laser 3D profile measuring instrument in China, high-precision point laser displacement sensor, etc.


Dongsheng (Suzhou) Intelligent Technology Co., Ltd. (hereinafter referred to as Dongsheng Intelligent), an enterprise in the field of industrial visual inspection, announced the completion of a round of A+ financing of tens of millions of RMB. This round was led by Zhuopu Capital and Xuantian Industry, followed by old shareholders Green River Capital, Yuanhe Holdings and industrial investors. It is understood that after this round of financing, Dongsheng Intelligent will further increase its R&D investment, form a product matrix, and achieve in-depth layout of subdivided industries while building an industry-leading industrial AI visual algorithm platform. After introducing strategic investment in the semiconductor industry, Dongsheng Intelligent also obtained an entry ticket to the semiconductor industry, and will work together to deeply penetrate the semiconductor field to achieve industrial breakthroughs. With machine vision and deep learning algorithms as the core, Dongsheng Intelligent provides standardized AI visual algorithm platforms, AI smart cameras, AI smart data analysis systems and full solutions for the industrial field, improves product quality management, improves production efficiency, and provides strong guarantees for factories to improve product yield and production capacity, and deeply empowers the upgrading of the intelligent manufacturing industry. In just two and a half years since its establishment, the company has completed four rounds of financing, integrating the forces of state-owned capital, industrial strategic investment, well-known industry investment institutions, and other parties, and uniting the industry ecology to create a standardized AI industrial series of products that originate from the industry, rely on the industry, and serve the industry. The company was founded in 2019 and is headquartered in Suzhou.


Independent third-party chip testing and operation management service provider Xinxinan Electronics announced the completion of tens of millions of angel round financing, invested by Walden International. The funds will be mainly used to purchase equipment, build an operation management service platform, introduce talents, and promote the localization of the semiconductor testing supply chain. Xinxinan Electronics was established in 2017 and is headquartered in Kunshan. It is mainly engaged in the development, application and marketing of IoT-specific integrated circuits based on radio frequency identification technology; independent semiconductor operation services featuring semiconductor chip testing services.


Micro-Chong Semiconductor, a domestic semiconductor testing equipment company, announced the completion of tens of millions of Pre-A round of financing, led by Yunqi. Previously, Yunqi participated in its angel round of financing. Micro-Chong Semiconductor is committed to the research and development of the most advanced material testing technology and the production of advanced semiconductor front-end testing equipment. Headquartered in Beijing, it was established in 2021.


Material


Akhan Semiconductor has raised $20 million in venture capital for its diamond nanocarbon material manufacturing technology. Akhan has developed several diamond nanocarbon-based products, including diamond glass for smartphones, thin-film diamonds for protecting optical components, and diamonds for wide-bandgap power electronics. It plans to use the funds to bring its diamond glass to market. Headquartered in Gurnee, Illinois, USA, it was founded in 2013.


Wuxi WuYue Semiconductor Co., Ltd. (hereinafter referred to as "WuYue Semiconductor") recently completed a round A financing of several hundred million yuan. This round of financing was led by Dachen Capital, followed by Xintou Group, Tsinghua Strait Investment, Longding Capital and others. It is reported that the funds from this round of financing will be mainly used for the research and development and expansion of WuYue Semiconductor's gallium nitride self-supporting substrates. Founded in March 2019, WuYue Semiconductor is a semiconductor research and development and design service provider dedicated to the research and development, production and sales of semiconductor crystals, wafers, chips and devices, as well as the design, research and development and manufacturing of semiconductor manufacturing equipment. It is reported that the company is mainly engaged in the research and development, production and sales of third-generation semiconductor material gallium nitride (GaN) self-supporting substrates. It is one of the few gallium nitride self-supporting substrate manufacturers in the world with completely independent intellectual property rights.


Hongzhiwei Technology has received hundreds of millions of RMB in strategic investment from Shengyu Investment, Panhou Capital, Shengyu Huatian Industrial Fund, and the National Small and Medium Enterprise Development Fund. The amount of this round of financing ranks in the top 50% of all strategic investments this year. Hongzhiwei Technology is headquartered in Shanghai, China. It is a material design software and integrated circuit device simulation software developer. It has developed most of its software in cooperation with several Chinese universities and research institutions. It is headquartered in Shanghai and was established in 2014.


Morion NanoTech raised more than RMB 100 million in Series B funding from Chendao Capital and Yuexiu Industrial Investment Fund. Morion produces graphene materials for electronic and new energy applications, including thermal management products and micro- and nano-cavity superconducting films. It is planning to expand into aerospace and biomedical applications. Funds will be used for production line construction, product development and business expansion. Founded in 2015, it is headquartered in Dongguan.


Shanghai Benno Electronic Materials Co., Ltd. (hereinafter referred to as "Benno Electronics") has completed a B+ round of financing of tens of millions of RMB. This round of financing was led by Jiangsu Xinchao Technology Group Co., Ltd. (Xinchao Technology), followed by Jiangsu Private Investment Holding Co., Ltd. (Sumin Investment), and Index Capital served as the exclusive financial advisor. It is reported that the funds from this round of financing will be mainly used for R&D investment and capacity expansion. Previously, Benno Electronics had received strategic investment from Huawei Hubble and SMIC Juyuan. Du Wei, co-CEO of Benno Electronics, said that Benno Electronics has 14 years of experience in the industry and has accumulated a certain customer base, industry reputation and professional capabilities; the company has established a professional material laboratory that can meet the analysis and testing needs of various materials; it has complete platform development and customized development capabilities to ensure leading product performance and stable quality, while meeting the needs of customers in the segmented market for product professional depth and universal breadth. The company was founded in 2009 and is headquartered in Shanghai.


Bolant Semiconductor proposed a strategic investment. The company produces sapphire wafers, patterned sapphire substrates, and conductive and semi-insulating silicon carbide substrates. It plans to set up a subsidiary to establish a GaN/SiC R&D center and MEMS packaging line. Bolant was founded in 2012. The company adopts internationally leading optical and semiconductor preparation process technology and uses advanced new semiconductor material processing equipment. It is mainly committed to the research and development and industrialization of GaN-based LED chip (patterned) substrates and third-generation semiconductor materials. The company's main products include sapphire flat wafers, PSS, silicon carbide substrates and lithography machine transformation equipment. The headquarters is located in Jinhua, China.

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Reference address:More than half are domestic companies! In February, 95 global electronics companies received a total of US$3 billion in investment

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