Cadence releases new Celsius Studio AI thermal analysis platform, significantly promoting ECAD/MCAD integration

• Simultaneous analysis of thermal, stress, and electronic thermal designs allows designers to seamlessly leverage ECAD and MCAD for multiphysics simulation of electromechanical systems
  

• Integrate FEM and CFD engines to address a variety of thermal integrity challenges—from chips to packages, circuit boards to complete electronic systems

• Celsius Studio features a massively parallel architecture that delivers 10x faster performance than previous solutions

• Celsius Studio seamlessly integrates with Cadence chip, package, PCB and microwave design platforms to support simultaneous thermal analysis and final sign-off of designs

Shanghai, China, February 1, 2024 - Cadence Electronics (Cadence, Inc., USA) today announced the launch of Cadence® Celsius™ Studio, the first in the industry to provide complete AI thermal design and analysis solutions for electronic systems. Celsius Studio can be used for electronic thermal design of PCBs and complete electronic assemblies, as well as thermal and thermal stress analysis of 2.5D and 3D-IC packages. While current products on the market are largely composed of disparate fragmented tools, Celsius Studio introduces a new approach that allows electrical and mechanical/thermal engineers to simultaneously design, analyze and optimize product performance through a unified platform without the need for geometry simplification. , operations and/or transformations.

Celsius Studio brings a new system-level thermal integrity solution that integrates electrical and thermal co-simulation, electronic cooling and thermal stress analysis. With Cadence's 2022 acquisition of Future Facilities, electrical and mechanical engineers now have access to best-in-class electronic cooling technology. In addition, Celsius Studio can be used seamlessly for simultaneous multiphysics analysis of designs, helping designers identify thermal integrity issues early in the design process and effectively leverage generative AI optimization algorithms and novel modeling algorithms to determine ideal thermal dissipation. design.

Ultimately, designers can streamline workflows, improve team collaboration, reduce design iterations, and achieve predictable design schedules, thereby shortening turnaround times and speeding time to market. Celsius Studio offers the following benefits:

• ECAD/MCAD unification: Design files are seamlessly integrated without simplification, and the workflow is smoother, enabling fast and efficient design synchronization analysis.

  
  

• AI design optimization: Celsius Studio is equipped with the AI ​​technology of Cadence Optimality™ Intelligent System Explorer, which can quickly and efficiently explore the entire design space and lock in the ideal design.

  
  

• Simultaneous design analysis of 2.5D and 3D-IC packages: With unprecedented powerful performance, it is easy to analyze any 2.5D and 3D-IC packages without any simplification and accuracy.

  
  

• Micro and macro modeling: Everything from the chip and its power distribution network to the chassis structure used to place the PCB can be accurately modeled, which is truly innovative in the market.

  
  

• Large-scale simulation: Accurately simulate large-scale systems and perfectly restore the details of structures such as chips, packages, PCBs, fans, or chassis.

  
  

• Multi-stage analysis: Help designers perform multi-stage analysis on the design assembly process to solve the 3D-IC warpage problem of multi-die stacks on a single package.

  
  

• True system-level thermal analysis: Combine Finite Element Method (FEM) and Computational Fluid Dynamics (CFD) to perform full system-level thermal analysis from chip to package to circuit board and end system.

  
  

• Seamless integration: Integrates with Cadence implementation platforms, including Virtuoso® Layout Suite, Allegro® X Design Platform, Innovus™ Implementation System, Optimality Intelligent System Explorer and AWR Design Environment®.

"The advent of Celsius Studio is a milestone for Cadence in developing the system analysis market. It not only provides an ideal AI platform for chip, package and PCB thermal analysis, but also provides an excellent AI platform for electronic heat dissipation and thermal stress analysis. For today's advanced This type of analysis is critical for packaging design, including chiplets and 3D-ICs," said Ben Gu, global vice president and general manager of Cadence's Multiphysics Simulation Group. "Celsius Studio works seamlessly with Cadence's powerful implementation platform. Integration enables our customers to perform simultaneous analysis of multiphysics designs from chips, packages and boards to complete systems.”

client feedback

"Celsius Studio helps Samsung semiconductor engineers gain analysis and design insights in the early stages of the design cycle, quickly generating accurate simulations of 3D-IC and 2.5D packages in an easier way. Through our partnership with Cadence, our product development efficiency has increased 30%, while optimizing the packaging design process and shortening the turnaround time.”

- WooPoung Kim, Head of Advanced Packaging,

Samsung Device Solutions Research America

"Celsius Studio seamlessly integrates with the Cadence AWR Microwave Office IC design platform through BAE Systems' custom GaN PDK, enabling fast and accurate thermal analysis throughout the MMIC design cycle, increasing the probability of first-time success of the design and significantly improving Performance of RF and Thermal Power Amplifiers.”

- Michael Litchfield, Technical Director, MMIC Design at BAE Systems

“With Celsius Studio, our design team is able to capture the details and work early in the design cycle so that thermal issues can be identified and resolved before the design is fully launched into production. With turnaround times significantly reduced, it is now easier to develop these complex designs In the process, the Chipletz engineering team was able to run efficient and detailed thermal simulations for 3D-IC and 2.5D packages multiple times early in the process."

-Jeff Cain, VP of Engineering, Chipletz