Core unveiled | Cool Core exhibits at the 2023 Shenzhen Drone Conference with its new AR803X wireless communication chip and solutions

Core unveiled | Cool Core participated in the 2023 Shenzhen Drone Conference with its new AR803X wireless communication chip and solution and won the Unmanned System Little Giant Award

Recently, Hefei Cool Core Microelectronics Co., Ltd. (hereinafter referred to as "Cool Core Microelectronics"), which specializes in wireless image transmission and AI vision SoC chip design, was invited to participate in the 2023 seventh exhibition with the theme of "Smart Painting of Heavenly Road·Win-Win Future" The World Drone Conference and the 8th Shenzhen International Drone Exhibition. At this exhibition, Coolcore unveiled its new AR803X series of wireless communication chips and solutions, exhibited its partners' new drone products based on Coolcore chips, and won the Little Giant Award for Unmanned Systems.

 Cool core booth

 Cool Core Product Manager Wu Shenglong (second from right) came to the stage to receive the award

According to Yang Jincai, academician of the European Academy of Sciences and executive chairman of the World Drone Conference, driven by the two wheels of market and policy, my country's low-altitude economy has developed rapidly, especially the civil drone industry, which has developed rapidly and is in a leading position in the world, with a market share of , R&D and manufacturing capabilities, and application breadth and depth have formed strong advantages. It is expected that by 2024, the market size of China's drone industry will reach 160 billion yuan.

In addition to the aerial photography and entertainment of consumer drones, the application of industrial drones in agricultural plant protection, power detection, energy exploration, logistics and transportation is also deepening, and the requirements for chips are naturally higher.

Shen Bo, co-founder and CTO of Cool Core, gave a speech titled "New Image Transmission Chip AR803X to Help the Development of the UAV Industry" at the Unmanned Systems Intelligent Chip Technology Forum. In his speech, he discussed the communication distance, frequency band, communication rate and networking method. These four dimensions clearly explain the different needs of consumer and industrial drones for image transmission/data transmission, and explain to the audience in detail that Coolcore AR803X meets the diverse needs from the bottom of the chip to help the reliable connection of drones.

 Keynote speech by Shen Bo, co-founder and CTO of Cool Core

"The new image transmission chip AR803X helps the development of the drone industry"

AR803X UAV image transmission solution

The AR803X series, as Coolcore’s fourth-generation full-band wireless communication chip, has a wide range of application prospects in both consumer drones and industrial drones. The chip can provide wireless RF full-band communication capabilities and can realize drones. One machine can control multiple machines, one machine can control multiple machines, relay communication and multi-machine networking functions, achieving a communication distance of up to 15km or more.

P401-D broadband wireless data transmission module 

Suitable for industrial drone wireless transmission

The P401-D broadband wireless data transmission module based on AR803X provides a small modular solution for the needs of industrial drones to meet customers' rapid development needs.

The maximum transmission distance is more than 15km (open space without interference)

2.4GHz&5.8GHz dual-band operation

Supports multi-node star networking and relay networking, and can build Mesh networking applications

Supports ranging function between AP and Device

Stamp hole packaging, based on the fourth generation image transmission chip AR8032S solution

The maximum air interface transmission rate can reach 160Mbps

AI Vision SoC ARD33 

Meet the needs of low-cost, long-distance intelligent drones

In addition, the Harbourson Black Hawk 1 UAV displayed this time is equipped with the Coolcore Intelligent AI Camera SoC chip ARD33. This chip has built-in EIS, DSP and 3.2T NPU computing power, which can reduce the overall cost for system manufacturers. It allows entry-level drones to achieve higher identification and tracking capabilities at a lower cost and with higher image quality.

Harbertson prototype, not officially released yet

As a company that has been deeply involved in the field of wireless communications for more than ten years, Kuxin has cooperated with most drone manufacturers on the market for many years. With a deep understanding of the industry, Kuxin will continue to focus on continuous breakthroughs in technology, aiming to bring better solutions for transmission and intelligent vision in the drone industry from technological improvements on the chip side.