MediaTek builds global Wi-Fi 7 ecosystem to prepare for mass production

January 6, 2023 - As one of the first companies in the world to invest in the development of Wi-Fi 7 wireless connection technology, MediaTek will showcase its complete Wi-Fi 7 global ecosystem for the first time at the 2023 International Consumer Electronics Show (CES 2023) to welcome the mass production of next-generation wireless terminal devices . MediaTek Wi-Fi 7 products are committed to achieving a stable and long-lasting wireless connection experience on various types of terminals, including residential gateways, Mesh routers, TVs, streaming devices, smartphones, tablets, laptops, etc. These terminal products will demonstrate the results of MediaTek's continued investment in Wi-Fi 7 technology.

As the latest generation of Wi-Fi standards, Wi-Fi 7 has powerful performance, supports 320MHz channel bandwidth and 4096-QAM modulation technology, and greatly improves user experience. Thanks to Multi-Link Operation (MLO), Wi-Fi 7 can aggregate multiple channels to alleviate link interruption problems in network congestion environments, providing faster, more stable, and more reliable connections.

Haojun Xu, Vice President and General Manager of MediaTek's Smart Connectivity Business Unit , said: "Last year, we were the first in the world to complete a live technical demonstration of Wi-Fi 7. Now, we are very honored to show the great progress MediaTek has made in building a more complete product ecosystem. Many of these terminal devices use the Filogic 880 flagship wireless connection platform that won the Innovation Award at CES 2023, confirming the top strength of MediaTek's Filogic series platform to provide an excellent wireless connection experience."

MediaTek's Wi-Fi 7 wireless connection platform uses a 6nm process, which reduces power consumption by 50% and MLO switching latency by 100 times compared to other solutions. Through 4T5R multi-antenna technology and five-band networking, MediaTek Wi-Fi 7 wireless connection solution has a wider signal coverage and supports more terminal connections.

The multiple terminal devices demonstrated by MediaTek at CES 2023 all use the latest Filogic series wireless connection platform. The MediaTek Filogic 880 platform supports Wi-Fi 7 for operators, router retail and enterprise markets, and the Filogic 380 platform is designed to bring Wi-Fi 7 connectivity to a wide range of terminals such as smartphones, tablets, laptops, TVs and streaming devices.

“We are excited to collaborate with MediaTek on the latest Wi-Fi 7 technology,” said Jason Banta, corporate vice president and general manager of OEM Client Computing at AMD . “Fast, reliable wireless connections are critical to users, and AMD Ryzen processors with MediaTek’s advanced wireless connectivity will deliver an exceptional user experience.”

Ouyang Jun, Vice President of Lenovo Group and General Manager of IDG Consumer Business Group , said: "Strong, fast and stable Wi-Fi connection is one of the key elements of competitive gaming and often affects the outcome of the game. MediaTek's pursuit of excellent Wi-Fi connection experience coincides with our vision of providing players with immersive and high-performance PC gaming experience. We look forward to working with MediaTek to introduce Wi-Fi 7 technology to the upcoming Lenovo Legion series of new products."

“MediaTek Filogic series wireless connectivity platforms provide high-speed, stable and long-lasting Wi-Fi solutions,” said Yangguang Zhang, General Manager of ASUS Computer Gaming Business Unit. “With MediaTek’s advanced Wi-Fi technology and innovative ecosystem, we will provide industry-leading gaming experiences to gamers around the world.”

TP-Link Vice President and General Manager Li Pingji said: "By achieving 320MHz channel bandwidth and multi-link operation (MLO) in the 6GHz band, Wi-Fi 7 can provide higher transmission speeds and lower latency. The innovative design of the MediaTek Filogic 880 platform combined with key Wi-Fi 7 technologies such as 4×5 6GHz band and single-chip MLO can bring outstanding performance. As a long-term partner of MediaTek, we will work together to bring innovative application experiences to users through Wi-Fi 7."

“For more than 23 years, BUFFALO has been at the forefront of connectivity products and services and has always been the first to adopt the latest Wi-Fi technologies, including Wi-Fi 7,” said Nobuhiro Tamura, General Manager of Network Product Development at BUFFALO. “We are very impressed by MediaTek’s investment in cutting-edge technology and would like to congratulate them on their latest Wi-Fi 7 solutions at CES 2023.”

“Today’s consumers demand high-speed, stable and long-lasting Wi-Fi connections for applications such as video calls, 4K/8K TV entertainment, real-time gaming and streaming,” said Byung-Kyun Kim, senior vice president of Korea Telecom Corporation. “MediaTek Wi-Fi 7 technology’s high throughput and single-chip MAC Multi-Link Operation (MLO) support smooth use of a variety of network-demanding applications.”

Mr. Yu, Senior Vice President of Hisense Group said: “By using MediaTek single-chip MLO technology, we are able to achieve high throughput and low latency, improving the user experience of various immersive content such as streaming and gaming. Hisense will continue to work with MediaTek to use Wi-Fi 7 technology to bring an excellent wireless experience to Hisense TV products.”

“MediaTek understands the need and expectation for high-speed connectivity and low latency in wireless devices. The reference design created jointly by Skyworks and MediaTek provides a platform for customers to develop innovative applications,” said John O’Neill, vice president of marketing at Skyworks . “We are honored to work with MediaTek on cutting-edge technology that will enable customers to realize the potential of key Wi-Fi 7 features such as 320MHz, 4K QAM and Multi-Link Operation (MLO).”

Tony Testa, general manager of Qorvo’s Wireless Connectivity business unit , said: “MediaTek has been a strong advocate for Wi-Fi 7, helping customers achieve significant improvements in network throughput, low latency, client connectivity and reliability. We are pleased to enable technical features such as 4K QAM, 320MHz and 6GHz bands, and multi-link operation through MediaTek Wi-Fi 7 solutions.”

“As enterprises move to Wi-Fi 7, testing the faster and faster data models available becomes critical, and we have collaborated with MediaTek to create an industry-leading test solution to meet this need,” said John Lukez, vice president of applications engineering at LitePoint. “Collaborating with Wi-Fi industry innovators like MediaTek will help our mutual customers accelerate product rollouts as a new era of wireless connectivity arrives.”

“The speed with which MediaTek has brought advanced technologies such as single-chip MAC multi-link operation (MLO), 320MHz bandwidth and 4096 QAM to market is impressive,” said Jesse Lyles, vice president of semiconductor verification and electronic solutions at NI . “The increased complexity of achieving Wi-Fi 7’s high performance and backward compatibility has significantly increased the need for comprehensive automated test and validation solutions. NI’s collaboration with MediaTek through software-connected RF instrumentation is helping our mutual customers achieve outstanding performance and meet time-to-market goals.”