Vishay Introduces New EMIPAK 1B Packaged Diode and MOSFET Power Modules

Vishay Intertechnology Launches New EMIPAK 1B Packaged Diode and MOSFET Power Modules to Provide Complete Solutions for In-Vehicle Charging Applications

Flexible devices use PressFit lead-fit technology to enable a variety of circuit configurations in a small package

MALVERN, Pennsylvania — November 24, 2022 — Vishay Intertechnology, Inc. recently announced seven new diode and MOSFET power modules specifically for in-vehicle charging applications . The integrated solutions with various circuit configurations use patented PressFit pin press technology to combine high-efficiency fast body diode MOSFETs and SiC, FRED Pt® and MOAT diode technologies in a small EMIPAK 1B package.

The Vishay Semiconductors devices released recently have various circuit configurations required for AC/DC, DC/DC and DC/AC conversion in on-board charging applications, including input/output bridges, full-bridge inverters and power factor correction (PFC), suitable for various power ratings. The modules meet the AQG-324 automotive standard and can provide complete solutions for electric (EV) and hybrid (HEV) vehicles as well as electric bicycles, agricultural machinery, railway vehicles, etc.

The device EMIPAK package adopts a matrix approach to build various customized circuit configurations in the same small package of 63 mm x 34 mm x 12 mm. Compared with discrete solutions, it helps to improve power density while providing flexibility to use each module at different power levels in industrial and renewable energy applications, such as welding, plasma cutting, UPS, solar inverters and wind turbines.

The device's AI2O3 direct bonded copper (DBC) substrate improves thermal performance, and the optimized layout helps reduce stray inductance and improve EMI performance. The module's PressFit pin press technology facilitates PCB installation and reduces substrate mechanical stress, while the baseless structure reduces the number of interfaces that need to be soldered and improves reliability.

Device configuration table:

Vishay offers a full range of silicon technology power modules, including Si and SiC diodes, thyristors, IGBTs and MOSFETs, as well as passive components such as capacitors, shunts, NTC and PTC thermistors . Devices can be used to configure a variety of topologies, including standard solder pins and PressFit terminals, suitable for a wide range of power. Power modules meet industrial standards and can be customized to meet specific application requirements, with high flexibility and cost-effectiveness, helping designers to accelerate time to market and improve overall system performance.

Samples of the new power modules are available now. Production lead times are 26 weeks.