Solder-free LED array lamp holder base technology provides solutions for OEM design

　　Molex, a global supplier of full-range interconnect products, has announced the launch of a new array lamp holder substrate technology with complete electrical, mechanical and optical connectivity, which has been integrated into the recently released Vero* array product of BridgELux.

　　The new LED array lamp holder base technology market is positioned to provide solder-free solutions for OEM designs, eliminating manual soldering or SMT soldering steps, reducing expensive SMT equipment investment, and simplifying the LED installation process. These lamp holders allow customers to quickly install LED arrays into lamps, achieve on-site replacement, and facilitate upgrades for existing applications.

　　Molex's LED array lamp holders use double-ended wire terminals to simplify array installation and flexibly arrange cable routing for optimal wiring. The releasable hub terminals can be replaced on site, facilitating upgrades to existing applications. Molex has now developed a series of solutions for COB lamp holders for installing COB arrays in lamps. Using these lamp holder products, LEDs can be easily integrated into lighting fixtures without the need for special tools. By providing clean and consistent installation every time, the unique press-type contact powers the LED array while avoiding welding variability and reducing foreseeable quality issues.

　　By eliminating the secondary processing of wire welding, Molex lamp holder products can help OEMs speed up the design process and meet system-level integration challenges. Molex solderless LED array lamp holders can shorten installation time, increase connection options and reduce costs. Its solderless screwdown connection can achieve standardized manufacturing processes and simplify the design of Bridgelux arrays.

　　随着LED技术越来越普及，开发能够简化安装过程且不影响可靠性或能效的互连产品成为一大挑战。Molex的灯座产品利用公司常年在互连方面的专业知识，为Bridgelux数组用户提供单件式免焊连接，不仅安装简便，而且显著改进了传统LED装配选项。

　　This new technology from Molex moves connectivity and ease of use from the LED array substrate to a separate plastic substrate, improving thermal, optical and mechanical interconnect capabilities. Technology improvements here include thermally isolated solder tabs, an integral Molex Pico-EZmate^(TM) header, and improved mechanical attachment and optical referencing features while maintaining an extremely low profile.

　　Compared to existing LED array packages that require soldering on materials such as aluminum or ceramic, the new product's solder tab design simplifies the direct soldering process and improves robustness. The Pico-EZmate connector header option enables a solderless electrical interface for field repair and replacement.

　　Molex developed this special material for LED components, thermoplastics, through advanced R&D processes, evaluation and testing. This plastic can be combined with LED array packaging in a variety of ways to provide an array top surface with a variety of connection options. Additional multiple connection options make it easy to integrate functional, sensor, communication and other products into the LED lighting engine.

　　"From the perspective of heat dissipation, plastic resin array lamp holders are an excellent solution." said Zhuo Bingkun, director of marketing and key account management in Asia Pacific South. Molex provides a transparent LED protective cover with a spring lock function, and the lamp holder products also use thermoplastic plastic shells to adapt to high-temperature environments.