Coil module package for contactless ID cards: Infineon offers complete solution with integrated chip and antenna

At the heart of electronic ID cards (eIDs) and passports are robust and durable security solutions. Security chips packaged in a "coil on module" (CoM) offer clear advantages in this regard. Infineon Technologies AG is now expanding its globally recognized CoM portfolio with a complete solution for contactless ID cards. The new SLC52 security chip is now available and is integrated with the card antenna into a polycarbonate monolithic inlay (Inlam).

Traditional chip packaging is soldered or glued to the card antenna. However, with CoM packaging, the chip module communicates with the card antenna via wireless radio frequency (RF). This design no longer requires complex mechanical design, the card itself becomes more durable, and the production cost is reduced accordingly.

CoM packaging is already used in many payment cards and electronic ID cards that combine contact and contactless (dual interface). However, the CoM process also offers significant advantages for purely contactless electronic ID cards and passports:

• Flexible card layout, featuring the world’s thinnest module at just 125 microns, allows for improved card design and makes passports less rigid

• The durability of the 10-year validity document is enhanced by eliminating the weaknesses of the direct mechanical and electrical connection between the card antenna and the chip module.

• One-stop shopping helps shorten lead time and simplify supply

Next-generation chips enable consumer-friendly contactless cards

Transactions using contactless cards are generally much faster than contact cards that must be inserted into a card reader. Accordingly, multi-application cards combine multiple applications on one card and support new business models. For example, in Africa and Latin America, where banking infrastructure is relatively weak, there is a great demand for multi-functional electronic ID cards and government ID cards, so that citizens of these countries can also use their ID cards for financial transactions.

However, multi-application cards require larger memory capacities and special security structures in terms of chip solutions. Infineon's SLC 52 security chip is particularly powerful and versatile, with up to 700 KB of memory, Integrity Guard and advanced chip architecture . The SLC 52 security chip thus forms a solid foundation for a complete new contactless card solution. For more information, visit : www.infineon.com/CoM .

For more than 25 years, Infineon has been developing and manufacturing chip security solutions for payment cards, government certificates and the Internet of Things. With a global market share of 24.8% in 2016, Infineon once again dominates the microcontroller-based smart card IC market (IHS Markit, Technology Group, Smart Card Semiconductor Report, July 2017).

Learn more about the latest chip solutions for contactless payment, identification and transport ticketing at: www.infineon.com/trustech

About Infineon Technologies

Infineon Technologies AG is a world-leading semiconductor technology company that makes people's lives more convenient, safer and more environmentally friendly. Infineon's microelectronic products and solutions will lead you to a better future. In the 2016 fiscal year (ending September 30), the company's sales reached 6.5 billion euros and it has about 36,300 employees worldwide. Infineon is listed on the Frankfurt Stock Exchange (stock code: IFX) and the US over-the-counter market OTCQX International Premier (stock code: IFNNY).

Infineon Technologies China

Infineon Technologies AG officially entered the Chinese market in 1995. Since the establishment of its first company in Wuxi in October 1995, Infineon's business has achieved very rapid growth. It has about 2,000 employees in China and has become an important driving force for the development of Infineon's business in Asia Pacific and even globally. Infineon has established a complete industrial chain in China covering R&D, production, sales, marketing, technical support, etc., and has carried out in-depth cooperation with leading domestic enterprises and universities in sales, technology R&D, talent training and other aspects.