Google is moving some hardware production for its Nest thermostats and servers from China to other regions to avoid impending tariffs.
According to people familiar with the matter, Google has moved the production of most of its products sold in the United States to Taiwan. In addition, in order to circumvent tariffs, Google also plans to move the production of Nest thermostats to Malaysia and other regions.
This isn't the first time a company has decided to move production of products destined for the U.S. outside of China.
According to Jiwei.com's previous report, Foxconn's board nominee and head of the semiconductor division, Young Liu, said at an investor briefing in Taipei on Tuesday that Foxconn has sufficient capacity to supply Apple with iPhones sold in the United States, thereby avoiding the trouble of tariffs.
"25% of our production capacity is outside of China, and we can help Apple respond to its needs in the US market," Foxconn emphasized.
However, it is worth noting that although some companies are seeking to move production out of China, most of them are simply transferring products sold to the United States to other regions for production, rather than transferring entire production lines.
After all, for enterprises, China's production advantages cannot be replaced in a short period of time.
At the same time, compared with companies like Apple, the number of hardware products produced by Google in China can be said to be very small.
Previous article:Verint Launches Voice of the Customer Cloud Solution, Combining Digital Innovation with Voice Technology
Next article:Horizon Robotics joins hands with Xiaomi to create multiple smart devices
- Popular Resources
- Popular amplifiers
- e-Network Community and NXP launch Smart Space Building Automation Challenge
- The Internet of Things helps electric vehicle charging facilities move into the future
- Nordic Semiconductor Launches nRF54L15, nRF54L10 and nRF54L05 Next Generation Wireless SoCs
- Face detection based on camera capture video in OPENCV - Mir NXP i.MX93 development board
- The UK tests drones equipped with nervous systems: no need to frequently land for inspection
- The power of ultra-wideband: reshaping the automotive, mobile and industrial IoT experience
- STMicroelectronics launches highly adaptable and easy-to-connect dual-radio IoT module for metering and asset tracking applications
- This year, the number of IoT connections in my country is expected to exceed 3 billion
- Infineon Technologies SECORA™ Pay Bio Enhances Convenience and Trust in Contactless Biometric Payments
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- Microchip Accelerates Real-Time Edge AI Deployment with NVIDIA Holoscan Platform
- Microchip Accelerates Real-Time Edge AI Deployment with NVIDIA Holoscan Platform
- Melexis launches ultra-low power automotive contactless micro-power switch chip
- Melexis launches ultra-low power automotive contactless micro-power switch chip
- Molex leverages SAP solutions to drive smart supply chain collaboration
- Pickering Launches New Future-Proof PXIe Single-Slot Controller for High-Performance Test and Measurement Applications
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- The US asked TSMC to restrict the export of high-end chips, and the Ministry of Commerce responded
- The US asked TSMC to restrict the export of high-end chips, and the Ministry of Commerce responded
- [RVB2601 Creative Application Development] Start to go through the development process
- Op amp output clamping mechanism and avoidance methods
- 【Development and application based on NUCLEO-F746ZG motor】11. Parameter configuration - ADC configuration
- [Solved] Why can’t I change my profile picture?
- C2000 combines capacitive touch and host controller functions
- 7660 chip common mode inductor manufacturer
- Detailed explanation of FPGA - the driving engine of the artificial intelligence era
- Qorvo Online Design Conference - Ultra-Wideband Technology: Use Cases and Benefits
- How to choose operational amplifier in the front end of power system
- Why do voltage references have values like 2.495V or 2.048V?