Unleash the ultimate performance and flexibility of MPSoC
As Moore's Law approaches its physical limits, the focus of innovation in the semiconductor industry has shifted from improving performance and density and reducing costs to creating device integration and building heterogeneous system-level components , and Octavo Systems is an expert in this area.
In order to establish a new system-in-package (SiP) product series with good performance, power consumption and price balance, Octavo Systems turned its attention to the Xilinx Zynq UltraScale+ MPSoC platform and launched the new OSDZU3 product series , which not only maximized the performance and flexibility advantages of Xilinx MPSoC, but also provided a broader stage for the development of Octavo System.
Octavo Systems OSDZU3 SIP
Industry Challenges
The design and integration of electronic systems are challenging. Most components come from different manufacturers and even include non-silicon-based components. System designers often encounter problems when coordinating power management and memory devices, which requires multiple design iterations and may even lead to project delays.
Octavo Systems, headquartered in Austin, Texas, can help customers overcome the above challenges with its SiP devices that provide ready-to-use, highly integrated, one-stop solutions . The company's industry-leading SiP solutions can help customers reduce the size and complexity of their products and accelerate the time to market.
Our goal is to make this technology accessible to more people. System design is challenging. We are committed to eliminating the need for complex power or DDR interfaces, simplifying the design process to the maximum extent, so that customers can start designing immediately after getting started with SiP.
——Greg Sheridan
Vice President of Strategy and Marketing, Octavo Systems
solution
Octavo Systems SiP solutions are commonly used in markets such as industrial and aerospace, as well as other applications where size and time to market are critical. Octavo Systems recently began looking to build a new high-performance, low-cost SiP device and ultimately chose the Xilinx Zynq UltraScale+ MPSoC family for its design.
Xilinx Zynq UltraScale+ MPSoC devices provide the scalability of 64-bit processors while offering real-time control and a combination of hardware and software engines for graphics, video, waveform, and packet processing .
Built on a real-time processor and programmable logic platform, the device is available in various variants, including dual application processor (CG) devices and quad application and GPU (EG) devices , creating unlimited possibilities for applications such as 5G wireless, next-generation ADAS, and industrial IoT.
Design Results
Powered by Xilinx MPSoC, the OSDZU3 SiP solution provides designers with many easy-to-use microcontroller features, such as single power supply, voltage, and internal storage system . These new features will help Octavo Systems reach a wider customer base and help the company grow its business.
At the same time, with Xilinx MSoC, the solution also reduces the design size by 50% and significantly shortens the design cycle.
Learn more about Xilinx Zynq UltraScale+ MPSoC.
Please visit Official website area