Take a sneak peek at the conference schedule. There is always a topic that suits you. Welcome to sign up for the conference - IWAPS 2018
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Meeting Schedule
Conference registration fee
1. Conference fee: RMB 2,600 per person (including breakfast and lunch buffets and one formal dinner)
2. RMB 2,000 per student
Note: If you do not book a hotel room, you need to find a hotel by yourself.
Last year's event
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The First International Advanced Lithography Technology Symposium Concludes Successfully
meeting time
October 18-19, 2018
Meeting Place
Xiamen Haicang District DoubleTree by Hilton Hotel
Conference Introduction
In recent years, China's integrated circuit industry has flourished. Based on this situation, the International Workshop on Advanced Patterning Solutions (IWAPS) came into being. IWAPS provides a technical exchange platform for senior technical experts and outstanding researchers from the semiconductor industry and academia at home and abroad. Participants can share their research results on topics such as materials, equipment, processes, measurements, computational lithography and design optimization, discuss graphic solutions, and discuss upcoming technical challenges.
As the only high-end lithography technology seminar in China, its speakers are all invited senior experts from lithography and related fields at home and abroad, representing the international advanced level in their fields. The reports cover a wide range of topics, including the current status of technology, future development trends, and challenges. The seminar aims to provide participants with an interactive platform for in-depth discussions, and also provide more opportunities for researchers and engineers who want to learn more about the dynamics of the semiconductor industry at home and abroad.
organizer
National Integrated Circuit Industry
Technology Innovation Strategic Alliance
organizer
Institute of Microelectronics, Chinese Academy of Sciences
Xiamen Semiconductor Investment Group Co., Ltd.
co-organiser
Chinese Optical Society
Sponsors
Organizing Committee
Cao Jianlin
Chairman of the Organizing Committee
Chairman of the Integrated Circuit Industry Technology Innovation Strategic Alliance
Former Vice Minister of the Ministry of Science and Technology Researcher
Ye Tianchun
Vice Chairman of the Organizing Committee
Director and Researcher of the Institute of Microelectronics, Chinese Academy of Sciences
Executive Vice Chairman of the EDA Center, Chinese Academy of Sciences
Kafai Lai
Vice Chairman of the Organizing Committee
OSA and SPIE Association Fellow
IBM TJ Watson Researcher
Ted Liang
Vice Chairman of the Organizing Committee
Chief Engineer, Intel Corporation
Weiya
Secretary General of the Organizing Committee
Researcher at the Institute of Microelectronics, Chinese Academy of Sciences Director of the Computational Lithography R&D Center Director of the Integrated Circuit Computational Lithography and Design Optimization Open Laboratory
Speakers (partial)
Mark Phillips
Ph.D.
Intel Fellow
Director of lithography hardware and solutions
Heike Riel
Ph.D.
IBM Fellow
Executive Director of IBM Frontier Research Institute
Director of Internet of Things Technology and Solutions
Gandharv Bhatara
Ph.D.
Manager, Design to Silicon Division of Mentor Graphics
Yu Cao
Ph.D.
Senior Vice President of ASML and
General Manager of ASML Brion
Wim de Boeij
Ph.D.
ASML
Christopher J. Progler
Ph.D.
SPIE Fellow
CTO, Photronics
Satya Kurada
Ph.D.
Vice President of KLA-TENCOR
Toru KIMURA
Research Director, Fine Electronic Materials Research Laboratories, JSR Corporation
Hiromitsu Maejima
Manager of Coater/Developer marketing, TEL
Will Conley
SPIE Fellow
Staff Applications Manager, Cymer
Tom Obayashi
Ph.D.
Project Director of Toppan China
Yongdong Wang
Ph.D.
Senior Manager, Synopsys
Zhijian (George) Lu
Ph.D.
Business Director of DowDuPont Lithography Business Unit, DowDuPont Inc.
Qiang (Ken) Wu
Ph.D.
Deputy Director of ICRD Novel Devices and Materials Laboratory
Bi-Qiu (Dylan) Liu
Ph.D.
Manager of Lithography of HLMC
Chi-I Lang
Ph.D.
Senior Director of Engineering at Applied Materials
Barak Bringoltz
Ph.D.
Director of Modeling Technology, Nova measuring instruments
Thomas Scherübl
Ph.D.
Director of Product and Business, Carl Zeiss
Yanqiu Li
Ph.D.
Professor of Beijing Institute of Technology
Gonzalo R. Arce
Ph.D.
Charles Black Evans Professor in the Electrical and Computer Engineering Department at the University of Delaware
Mark Neisser
Ph.D.
Global R&D Director at Kempur Microelectronics Inc, Chair of the IRDS Lithography Technical Working Group.
Learn more details
Get the meeting schedule
Please pay attention to the official website
www.iwaps.org/cn
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Call for Papers/Posters
Abstract deadline: June 30, 2018
Abstract acceptance notification date: July 15, 2018
Poster submission deadline: August 31, 2018
Deadline for manuscript submission: September 30, 2018
Email for submission:
jomm_iwaps@ime.ac.cn
Poster size instructions
Final poster size: 78.5cm*203cm, of which 203cm includes 196cm of the image + 3cm of top fixing margin + 4cm of bottom fixing margin
Note: Please send the electronic version of the poster to the above email address before the deadline. You can bring the poster to the venue or mail it to the staff in advance. Recipient: Li Si, Contact: 15396280910, Mailing address: 1st Floor, Hailv Group, No. 99, Songyu East Road, Haicang District, Xiamen.
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