NI Fully Connected Summit Semiconductor Forum | Technical experts gathered to talk about semiconductor testing

Chen Caiyun

Semiconductor Business Application Engineering Team Manager

NI, Emerson T&M

Speech topic: VST for cutting-edge RF technology testing

Speech Abstract: This speech will introduce how the latest vector signal transceiver PXIe-5842 can accurately generate and measure the required wideband modulated signals, supporting up to 26.5GHz operating frequency and 2GHz bandwidth, and can be used to test various latest wireless communication standard products, including Wi-Fi 7, UWB, 6G FR3, etc.; it can also be applied to aerospace and defense scenarios. It has digital and analog pulse modulation functions, and supports traditional RF functions such as spectrum analysis, signal analysis, and signal generation, helping you overcome various test challenges.

Xu Pei

Head of Marketing

Nanjing Paige Measurement & Control Technology Co., Ltd.

Speech topic : High-power RF device testing technology

Speech Abstract: The speech will introduce three high-power test technologies for different scenarios and applications, including base station PA chip testing, mobile phone tuner switch testing, and filter resonator testing. The test methods and key tricks of these test technologies will be mainly introduced.

Sun Ye

Semiconductor Business Manager, Asia Pacific

NI, Emerson T&M

Speech topic: Introduction and application sharing of NI's new generation RF tester

Abstract:

Luo Jiexing

Product Manager (Test Automation)

Shanghai Gubo Technology Co., Ltd.

Speech topic: AI-assisted chip post-silicon verification practice

Speech Abstract: With the development of machine learning technologies including deep learning (DL), large language models (LLM), and reinforcement learning (RL), the field of chip post-silicon verification has ushered in innovative opportunities. This conference will explore in depth how to use various machine learning technologies to optimize the test requirements of chip post-silicon verification, disassemble test cases and generate test programs, collect test results and debug, trace back Spec indicators for comparison, and finally output the full process of Datasheet automation. We will explore the application of the latest AI algorithms in the actual chip post-silicon verification workflow to improve efficiency and shorten the development cycle.

Chen Yong

Chief System Architect

NI, Emerson T&M

Speech Topic: High-Speed ​​ADC (JESD204B) Test Solution

Speech Abstract: The traditional single-lane CMOS/LVDS interface can only cover data transmission rates below 1~2Gbps. In order to achieve a higher transmission rate, more interfaces can only be added. The higher-speed JESD204B/C does not have this problem. Therefore, JESD204B/C with a simpler interface will become the trend of high-speed data transmission. High-speed ADCs based on JESD204B/C will also become more and more popular. Therefore, NI proposed a high-speed ADC test solution based on PXIe-6594. This solution highly encapsulates JESD204B, so customers do not need to spend time on the implementation of the 204B protocol, which greatly simplifies the test of high-speed ADCs.

Zhou Xinmiao

Deputy General Manager

Zhongshan Boceda Electronic Technology Co., Ltd.

Speech topic: Standardized FCT platform design for mass production

Speech Abstract: At present, there are a large number of multi-type, small-batch mass production automated testing needs in the fields of industry, medical care, energy, and defense. Based on 20 years of industry experience, Boceda has summarized a modular standard testing platform, and proposed a complete solution from manual testing to semi-automatic testing to fully automated testing, and has achieved excellent results in many leading customers.

Li Cheng

Chief System Architect

NI, Emerson T&M

Speech topic : Optoelectronic application test solution based on PXI platform

Speech Abstract: AI, LLM and ML are driving the rapid development of high-performance computing. High-speed data transmission is the foundation of high-performance computing, and optoelectronics provides a solution for high-speed data transmission. In the stage of rapid evolution of optoelectronic technology, it has encountered problems such as multi-channel high-density transmission and heterogeneous integration, which also makes testing more complex and challenging; NI's solution based on the PXI platform integrates electrical and optical instruments, providing a high-quality and efficient platform for the testing and measurement of optoelectronic mixed signals.

• NI VST3 RF Instrumentation for Wireless Communications Testing