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The new i-ToF image sensor helps create a smaller 3D camera system, optimizing costs while improving quantum efficiency

Latest update time:2023-04-03 17:28
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Infineon and pmd, a high-quality partner specializing in the field of 3D ToF, jointly launched the IRS2976C time-of-flight (ToF) VGA sensor, an advanced version of the IRS2877C ToF VGA sensor. This sensor is a new member of the REAL3™ family of products.

This product uses Infineon's new pixel technology to increase the quantum efficiency of the pixels to more than 30%, reaching a level that has so far only been achieved by backside illumination (BSI) sensors, while maintaining the performance of frontside illumination (FSI) sensors. Cost advantage. Thanks to this, the IRS2976C image sensor has become the world's first ToF image sensor to obtain Google's third-level face recognition certification (enhanced level), and can run seamlessly under the display of mobile devices.


The IRS2976C image sensor supports a variety of long-distance, low-power usage scenarios, and the measurement distance can reach or exceed 10 meters. Like all other members of the REAL3™ family, every pixel of this image sensor incorporates Pandora's patented Suppression of Background Illumination (SBI) technology to deliver robust performance in high dynamic range (HDR) and daylight scenes. data.


Christian Herzum, Vice President of 3D Sensing Business at Infineon Technologies, said: "We use a unique ToF CMOS process to ensure excellent sensitivity and robustness in indoor and outdoor environments. In addition, our IRS2976C 3D ToF image sensor also has Powerful functions and excellent flexibility can optimize the design of 3D camera systems. This sensor is ideal for secure authentication in smartphones, payment terminals, smart door locks and other applications, and is also suitable for virtual reality and augmented reality (AR). /VR) headsets, service robots and various IoT devices.


The IRS2976C image sensor supports a system VGA resolution of 640 x 480. With the world's largest compact size of 23 mm², this image sensor is easily compatible with the previous IRS2877C image sensor and can be upgraded very conveniently. The ultra-high integration level greatly reduces the number of materials used in the sensor, making it smaller in appearance and simpler in design. The new IRS2976C image sensor can be used with Infineon's latest VCSEL driver IRS9102C to help developers design smaller and lower-cost 3D camera systems.


Availability

Engineering samples of the IRS2976C image sensor are now available. The new products have been showcased at Mobile World Congress 2023 in Barcelona, ​​Spain. For more information, please click here .


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