SiC and GaN power semiconductor market to exceed $10 billion in 2027!
Source: Content from "GaN World", thank you.
Key conclusions:
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The emerging market for silicon carbide (SiC) and gallium nitride (GaN) power semiconductors is expected to reach nearly $1 billion by 2020, driven by demand from hybrid and electric vehicles, power and photovoltaic (PV) inverters.
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The use of SiC and GaN power semiconductors in main drive train inverters for hybrid and electric vehicles will result in a compound annual growth rate (CAGR) of more than 35% after 2017, reaching $10 billion in 2027.
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By 2020, GaN-on-silicon (Si) transistors are expected to reach price parity with silicon metal oxide semiconductor field effect transistors (MOSFETs) and insulated gate bipolar transistors (IGBTs), while offering the same superior performance. Once this benchmark is reached, the GaN power market is expected to reach $600 million in 2024 and climb to more than $1.7 billion in 2027.
Expectations are high for continued strong growth in the SiC industry, driven primarily by growth in hybrid and electric vehicle sales.
Market penetration is also growing, especially in China, where Schottky diodes, MOSFETs, junction gate field effect transistors (JFETs) and other SiC discrete devices have appeared in mass-produced automotive DC-DC converters and on-board battery chargers.
It is increasingly clear that powertrain main inverters—using SiC MOSFETs instead of Si insulated gate bipolar transistors (IGBTs)—will begin to appear on the market within 3-5 years . Since so many devices are used in main inverters, far more than in DC-DC converters and on-board chargers, this will quickly increase the demand for equipment. Perhaps at some point in time, inverter manufacturers will finally choose to customize full SiC power modules instead of SiC discrete devices. Integration, control and packaging optimization are the main advantages of modular assembly.
Not only will the number of SiC devices per vehicle increase, but new global registrations for battery electric vehicles (BEVs) and plug-in hybrid electric vehicles (PHEVs) will also increase tenfold between 2017 and 2027 as many governments around the world target lower air pollution and fewer vehicles that rely on burning fossil fuels. China, India, France, the UK and Norway have all announced plans to ban cars with internal combustion engines and replace them with cleaner vehicles in the coming decades. The outlook for electrified vehicles in general will therefore be very good, and for wide bandgap semiconductors in particular.
Compared with the first-generation semiconductor material Si and the second-generation semiconductor material GaAs, SiC has better physical and chemical properties, including high thermal conductivity, high hardness, chemical corrosion resistance, high temperature resistance, and transparency to light waves. The excellent thermal properties and radiation resistance of SiC materials also make it one of the preferred materials for preparing ultraviolet photodetectors. In addition, SiC-based sensors can make up for the performance defects of Si-based sensors in harsh environments such as high temperature and high pressure, thus having a wider range of applications. Wide bandgap semiconductor power devices represented by SiC are currently one of the fastest-growing power semiconductor devices in the field of power electronics.
SiC power electronic devices mainly include power diodes and triodes (transistors, switch tubes). SiC power devices can double the power, temperature, frequency, radiation resistance, efficiency and reliability of power electronic systems, and significantly reduce volume, weight and cost. The application areas of SiC power devices can be divided by voltage:
Low voltage applications (600 V to 1.2 kV): high-end consumer applications (such as game consoles, plasma and LCD TVs, etc.), commercial applications (such as notebook computers, solid-state lighting, electronic ballasts, etc.), and other applications (such as medical, telecommunications, defense, etc.)
Medium voltage applications (1.2kV to 1.7kV): Electric vehicles/hybrid electric vehicles (EV/HEV), solar photovoltaic inverters, uninterruptible power supplies (UPS), and industrial motor drives (AC Drive), etc.
High voltage applications (2.5kV, 3.3kV, 4.5kV and above 6.5kV): wind power generation, locomotive traction, high voltage/ultra-high voltage transmission and transformation, etc.
The biggest inhibitor to SiC device growth may be GaN devices. The first automotive AEC-Q101-compliant GaN transistor was released by Transphorm in 2017, and GaN devices made on GaN-on-Si epiwafers are significantly lower cost and easier to manufacture than anything on SiC wafers. For these reasons, GaN transistors may become the preferred choice in inverters in the late 2020s, superior to more expensive SiC MOSFETs .
Transphorm's innovative Cascode structure
The most interesting story about GaN power devices in recent years has been the arrival of GaN system integrated circuits (ICs), which are GaN transistors packaged together with silicon gate driver ICs or monolithic all-GaN ICs . Once their performance is optimized for mobile phone and laptop chargers and other high-volume applications, they are likely to become widely available on a wider scale. In contrast, commercial GaN power diode development never really took off because they failed to offer significant benefits over Si devices and development proved too expensive and unfeasible. SiC Schottky diodes are well-positioned for this purpose and have a good pricing roadmap.
GaN power devices and other types of power semiconductors are used in the field of power electronics. Basically, power electronics utilize various solid-state electronic components to more efficiently control and convert electrical energy in everything from smartphone chargers to large power plants. In these solid-state components, the chip handles the switching and power conversion functions.
For these applications, GaN is an ideal choice. Based on gallium and III-V nitrides, GaN is a wide-bandgap process, which means it is faster and offers higher breakdown voltages than traditional silicon-based devices.
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