Nine core technologies of Changdian Technology

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Jiangsu Zhongpeng specializes in providing epoxy molding materials for packaging . Contact QQ or WeChat ID 416000888 (focusing on semiconductors and sharing resources)

【Reply Number 22】 IBM: Five predictions for the next five years

【Reply number 23】 JCET's nine core technologies

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1. Through Silicon Via (TSV) packaging technology
■ Realize chip-to-chip interconnection and high-density stacking in three dimensions
■ Improve product signal transmission speed
■ Reduce internal power consumption
■ Achieve the highest performance and smallest appearance of the product

2. SiP RF packaging technology
■ RF technology can be widely used in wireless communications, identity recognition and other fields, and has a very broad market prospect.

3. Wafer-level three-dimensional rewiring packaging process technology
■ Through rewiring design, the originally irregularly arranged I/O electrodes are arranged in an array.

4. Copper bump interconnection technology
■ Suitable for high-density, high-power packaging

5. High-density FC-BGA packaging and testing technology
■ Significantly reduce costs and reduce product size

6. Multi-circle array four-side pinless packaging and testing technology
■ A new packaging technology to replace traditional packaging below 500 pins

7. Three-dimensional packaging stacking technology
■ Fully saves the area occupied by the product on the PCB and reduces signal interference.

8. 3D stacking packaging technology for ultra-thin chips below 50μm
■ Ultra-thin grinding technology for ultra-large wafers
■ Ultra-thin dicing technology for ultra-large wafers
■ Ultra-thin chip stacking technology
■ Ultra-thin multi-layer chip bonding technology
■ Multi-layer chip ultra-thin encapsulation technology

9. MEMS multi-chip packaging technology
■ MEMS wafer mounting technology
■ MEMS wafer cutting technology
■ MEMS product mounting technology
■ MEMS chip-to-chip bonding technology
■ MEMS product coating technology

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We are setting up professional WeChat groups for wearable devices, MEMS industry groups, and packaging and testing industry groups. Interested parties can add the private WeChat account 416000888, and the QQ group of 1,000 people is 94983436

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23. Nine core technologies of Changdian Technology

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