CMOS sensor 3D-IC production capacity increases, wafer-level packaging equipment demand grows

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EV Group (EVG), a leader in microelectromechanical (MEMS)/nanotechnology/semiconductor wafer bonding and lithography equipment, announced today that the company’s fully automated 12-inch (300mm) wafer bonding systems using polymer adhesives are in strong demand. Over the past 12 months, orders for EVG’s wafer bonding series products, including the EVG560, GEMINI and EVG850TB/DB, have doubled, primarily from multiple orders from foundries and Asia-based semiconductor assembly and test (OSAT) facilities. Much of the growth in order demand is driven by advanced packaging applications, as manufacturing accelerates the production of CMOS image sensors and vertically stacked semiconductors that combine 2.5D and 3D-IC through silicon via (TSV) interconnect technology.

According to market research and strategy consulting firm Yole Développement, the equipment market for 3D-IC and wafer-level packaging (WLP) applications will grow significantly, with total revenue expected to grow from US$933 million in 2014 to US$2.6 billion in 2019, with a compound annual growth rate of 19% in the next five years. Wafer bonding technology using polymer adhesives plays an indispensable role in supporting these applications.

EVG pointed out that wafer bonding using polymer adhesives is a technology that uses an intermediate layer (usually a polymer) to bond two substrates. This process technology is very important for advanced packaging applications. The main advantages of using this method include low-temperature processing, surface flattening, and high and low tolerances of wafer pattern structures. For CMOS image sensor applications, bonding technology using polymer adhesives provides a protective barrier between the image sensor surface and the covering glass wafer. In 3D-IC TSV applications, this bonding technology plays an important role in temporary bonding and debonding applications, in which the product wafer can be temporarily placed on a carrier using an organic adhesive to achieve reliable thinning and back-end processing.

Fully automated wafer bonding solutions are particularly important for CMOS image sensors and stacked memory/logic applications, which can support manufacturers in moving to larger (12-inch) wafer substrates to reduce total production costs. EVG said that, for example, minimizing total thickness variation is the key to determining the thickness tolerance of the final product, and will ultimately have an impact on the realization of thinner wafers and components, thereby achieving higher interconnection density and lower TSV integration costs. Its fully automated wafer bonding system optimizes control of total thickness variation and other parameters through repeated wafer-to-wafer processes and integrated built-in measurement devices. Therefore, manufacturers are increasingly turning to EVG to support their needs for fully automated wafer bonding.

Hermann Waltl, Executive Director of Sales and Customer Support at EVG, said that the company has entered the 3D-IC era and that the demand for TSV wafers is growing in many areas, including CMOS image sensors required for smartphone cameras and automotive surround imaging, and 3D stacked memory and memory-on-logic that support high-performance, high-bandwidth applications such as networking, e-sports, data centers and mobile computing. For CMOS image sensor and semiconductor device manufacturers, fully automated wafer bonding is a key process to support the mass production needs of the above applications, and the company will be committed to providing value-added solutions for the advanced packaging market.

From: Lean News

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