Samsung Electronics supplies HBM3E to NVIDIA
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Source: Content compiled from zdnet, thank you.
Samsung Electronics and NVIDIA have successfully completed a recent audit of HBM3E (fifth-generation high-bandwidth memory). Although the mass production supply of the product is slower than initially expected, it has received positive reviews because the quality issues raised previously have been resolved.
However, this due diligence is an intermediate process of HBM supply and has no direct relationship with the final quality test. Therefore, there are many opinions that we need to wait for a while to see the prospects of HBM3E business between the two companies.
According to industry insiders on the 2nd, Nvidia visited Samsung Electronics' Pyeongtaek campus at the end of last month and conducted due diligence on HBM.
Samsung Electronics Pyeongtaek Factory (Photo credit: Samsung Electronics)
Multiple officials familiar with the matter explained that “NVIDIA recently visited the Pyeongtaek campus and inspected the 8-layer HBM3E,” adding that “it was concluded that the recent HBM quality issues were resolved during this inspection.”
HBM3E is the latest generation of commercial HBM. Samsung Electronics, for example, continues to conduct quality tests and supplies 8-layer and 12-layer products to Nvidia. Initially, the industry expected the results of the 8-layer product to be released in August or September, but the official quality approval has not yet been released. It is understood that the main problem is insufficient power.
Due diligence is the act of customers visiting a manufacturer's factory to inspect mass production lines and products. In the industry, it is considered a customary procedure that must be completed before passing quality tests. It is expected that through this due diligence, Samsung Electronics will be able to smoothly complete the internal mass production preparations for the 8-layer HBM3E.
However, the actual inspection has nothing to do with Nvidia's quality test results. In quality testing, not only the HBM itself must be verified, but also the yield and performance of the packaging stage combined with the system semiconductor must be additionally verified.
Therefore, analysts believe that it remains to be seen whether Samsung Electronics' HBM3E will be immediately mass-produced for Nvidia's high-performance AI accelerators "H200" and "B100."
Industry sources said the plan is more likely to be applied first to non-mainstream products such as low-priced client chips. In fact, Samsung Electronics supplied HBM3 to Nvidia's "H20" chip this year, which reduced the performance of H200 to target the Chinese market.
An industry insider explained that "the quality issues of HBM3E were resolved in the most recent inspection, which is a positive sign", but "the actual impact still remains due to the continuous postponement of final quality testing for full mass production supply."
Original link
https://zdnet.co.kr/view/?no=20241002112859
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