Corechip Semiconductor Releases EDA2024 Software Suite at DAC

Latest update time：2024-06-27

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June 26, 2024, Shanghai, China - Xpeed Semiconductor officially released the EDA2024 software suite at the DAC2024 Design Automation Conference held at the West Moscone Convention Center in San Francisco, USA on June 25, 2024. The software suite covers many important functions and upgrades in the fields of advanced packaging, high-speed systems, RF systems and multi-physics simulation.

Release Highlights

2.5D/3D Advanced Packaging SI/PI Simulation Platform Metis

Metis is a system-level SI/PI simulation platform designed for 2.5D and 3DIC advanced packaging. It can easily implement parameterized pre-simulation functions based on Interposer and transmission line templates, and support SI/PI and circuit joint analysis processes for 2.5D and 3DIC packaging.
Metis 2024 version newly developed System SI high-speed circuit simulation process, with an embedded XSPICE circuit simulation engine, allows users to directly evaluate whether the HBM design meets the time domain index requirements; the newly developed PI DC simulation process can quickly evaluate the voltage drop and current density hotspots and distribution cloud maps of the entire chiplets and 3DIC; the new optimization of the packaged DDR5 three-dimensional full-wave simulation process achieves 10x acceleration while ensuring the same accuracy as 3D FEM, and has obvious advantages in simulation scale.

3D full-range electromagnetic simulation platform Hermes

Hermes is a full-range electromagnetic simulation platform suitable for any 3D structure such as chips, packages, circuit boards, cables, connectors and antennas. It supports full 3D modeling and simulation functions, and includes four simulation processes: Hermes Layered, Hermes 3D, Hermes X3D and Hermes XFIT. Hermes Layered and Hermes 3D are based on 3D FEM full-wave algorithms, supporting electromagnetic simulation of 2.5D and any 3D structures from DC-THz respectively; Hermes X3D is based on the quasi-static moment method and supports rapid extraction of RLGC parasitic parameters such as packages, touch screens, and power devices; Hermes XFIT is based on the FIT simulation engine and supports simulation of antennas, electromagnetic compatibility, etc.
The Hermes platform is embedded with the FEM3D full-wave electromagnetic field simulation engine and the X3D RLGC parasitic parameter solver, which, together with the adaptive meshing and XHPC distributed simulation technology, realizes an efficient and easy-to-use simulation process and high-precision intelligent solving capabilities.
Hermes 2024 version Improves the editing of 3D structures and supports the creation and calling of 3D Component encrypted models; adds DTC templates for fast DTC parametric modeling.

Notus, a multi-field collaborative simulation platform

Notus is a platform for SI/PI collaborative analysis, topology extraction, and electrical-thermal-stress joint analysis at the package and board level in high-speed and high-frequency design. Through Notus simulation, you can quickly analyze whether the signal, power supply, temperature, and stress distribution meet standard requirements, accelerating user design iterations.
Notus 2024 version newly developed an electro-thermal collaborative analysis process based on the CFD simulation engine, which greatly improved the Notus system-level thermal analysis capability by accurately modeling the fan and chassis structure; PI DC and XTOP processes comprehensively upgraded the multi-board simulation process, realized the rapid power analysis and topology extraction capabilities of complex multi-board systems, and improved the more powerful and easy-to-use power tree control function; PI AC supports the DC fitted function to help improve the accuracy of high-current and high-power designs;

High-speed system verification platform ChannelExpert

ChannelExpert is a universal verification platform for the entire link of signal integrity in both time and frequency domains. It provides a fast, accurate and simple method to evaluate, analyze and solve high-speed channel signal integrity problems, with an embedded efficient and accurate XSPICE high-speed circuit simulation engine, supporting DC, AC, Transiet and eye diagram analysis functions.
ChannelExpert supports IBIS/AMI model simulation and AMI model creation; the schematic-like circuit editing interface and operations can help engineers quickly build high-speed channels, run channel simulations, and check whether channel performance meets specifications. It can also output DDR4/DDR5X/LPDDR4/LPDDR5X simulation reports according to JEDEC standards.
ChannelExpert 2024 version realizes direct interaction with Hermes and Notus platforms, supports field-circuit collaborative simulation; optimizes the schematic usage experience, supports manual and automatic wiring; adds bit-by-bit analysis function of multi-level modulation PAM 3/4/8; after a comprehensive revision, the processing module supports a new free canvas-style function editing and result processing function, and supports more than 90 waveform measurement functions; COM analysis is upgraded to version 4.1.

RF EDA Design Platform XDS

XDS is an RF system design platform for chip-package-module-PCB. It supports the field-circuit joint simulation process driven by PDK, has an embedded 3D full-wave fast electromagnetic simulation engine based on the method of moments, supports cross-scale simulation from chip to package, and has an embedded XSPICE RF circuit simulation engine, supporting DC OP, AC and tuning optimization simulations.
The XDS 2024 version newly integrates the FEM3D three-dimensional full-wave finite element electromagnetic simulation engine, providing more accurate solution options for RF modules and microwave applications, and supports one-click switching with the moment method engine; it has built-in multiple transistor models and supports more RF behavioral level and expression models; it also supports self-matching network synthesis, further supporting system-level RF system design simulation related functions.

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About Xcell Semiconductor

Xinhe Semiconductor is a high-tech enterprise engaged in the research and development of electronic design automation (EDA) software tools. It uses simulation to drive design and provides EDA solutions for the entire industry chain with completely independent intellectual property rights, covering IC, packaging to systems. It supports SoC advanced processes and Chiplet advanced packaging, and is committed to enabling and accelerating the design of a new generation of high-speed and high-frequency smart electronic products. It has been widely used in 5G, smart phones, the Internet of Things, artificial intelligence, data centers and other fields.

Xpeedic was founded in 2010 and has been awarded the title of National Small Giant Enterprise of Specialized, Innovative and New Technology and the First Prize of Shanghai Science and Technology Progress. Its operation and R&D headquarters are located in Zhangjiang, Shanghai, with R&D sub-centers in Suzhou, Wuhan and Xi'an, and sales and technical support departments in Silicon Valley, Beijing, Shenzhen, Chengdu and Xi'an. For more information, please visit www.xpeedic.com.

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